Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

29.03.2024 0:07:15
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Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Various



congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning
As Part of Collaboration, Companies Launch Cloud-Based Evaluation Environment for R-Car SoCs to Enable Simple Initial Evaluation for Device Selection

Lockheed Martin Aeronautics adopts Siemens’ Xcelerator portfolio to support digital engineering transformation

Farnell extends range of test and analysis products with Broadcom’s compact spectroscopy
Broadcom’s compact, versatile and reliable spectrometer modules are suitable for industrial sensing and mobile analytics in numerous applications.

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development
Improved user experience and more performance for applications in robotics, smart factory, and motion control

Competence on site
Laboratories and service centers are the nucleus of technological innovations - and ultimately guarantee customized solutions across all industries: Why the Customer Experience Center on the Panasonic Campus in Munich, with its bundled development and service competence, is the center for high technology that creates concrete added value.

Digi-Key and partners introduce LoRaWAN-in-a-box solutions
Digi-Key Electronics has partnered with Seeed Studio and Machinechat to launch LoRa WAN-in-a-box solutions for the internet of things (IoT).

Lattice Acquires Mirametrix
Expands Software Portfolio with Complementary AI and Computer Vision Capabilities

New Lattice sensAI Solution Stack Accelerates Next-Generation Client Devices
Latest Version of Solution Stack Offers New Features For Power-Efficient AI/ML Inferencing

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Lattice to Highlight Low Power ML Development with sensAI Solution Stack at ValleyML AI Expo 2021

Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications
Updated Stack Delivers Higher ISP Performance, Support for LPDDR4 DRAM, and Expanded Hardware Support for Popular Vision and High Speed Data Interfaces

Digi-Key Electronics Announces 2021 Back2School Prize Draw
Sweepstakes Fosters Innovation and Learning for Students

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters
Adaptec® Smart Storage Adapters Provide Increased Performance, Security and Scalability While Simplifying Storage Management

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products

element14 Presents celebrates its 500th Episode and announces Winners of the Build Inside the Box Challenge
‘Build Inside the Box’ contestants participated in a competition that looked similar to Food Network’s ‘Chopped,’ a cooking challenge in which chef contestants must create a palatable dish using the ingredients they are given.


Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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