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**-Updated DDR4 DIMM Sockets from Molex Offer Multiple Improvements for Greater Flexibility and Reliability

**-High-speed server memory applications benefit from advancements in socket styles and construction material

**-

LISLE, IL – July 29, 2014 – Molex Incorporated introduced today its DDR4 DIMM sockets in both aerodynamic and standard versions, giving design engineers more options and improved performance while remaining cost-competitive. The aerodynamic socket features a through hole termination style and streamlined latch and housing feature for better airflow and space-savings. The standard version features three termination styles: press-fit for solderless processes, surface mount technology for ease of printed circuit board (PCB) trace routing and through hole for cost-effective applications.

All DDR4 DIMM sockets from Molex meet JEDEC specifications and support UDIMMs, RDIMMs and LRDIMM memory applications for data, computing, telecommunication and networking servers with higher data speed and lower operating voltage than DDR3. The sockets also feature an innovative moisture-resistant, high-temperature nylon with a Coefficient of Thermal Expansion that makes them ideal for high-temperature processing operations.

“Customers deploying enterprise-level server systems are looking for interconnect solutions that provide design flexibility and cost savings while enabling virtually fail-proof reliability through round-the-clock operation hours,” said Poon Wai Kiong, global product manager, Molex. “By offering different styles and reducing the connector footprint for increased PCB space, Molex addresses these needs while offering superior electrical performance over the DDR3. And our innovative new construction material helps significantly reduce yield loss for greater cost savings and faster delivery.”

The press-fit DDR4 DIMM sockets provide a lower cost of operation with a clean, solderless process that eliminates the added heat-cycle, which can cause stress to the PCB or degrade electronic components. All of the connectors benefit from ergonomically designed socket latches that enhance usability with robust protection against high rip-out force and vibration. The dual-side lead-ins on the sockets facilitate smooth module insertion while stand-offs at the base simplify solder-joint inspection, measurement and rework. Profiled contact terminals prevent contact-stubbing and eliminate stress caused to the housing during terminal insertion while offering high connector durability by supporting up to 25 mating cycles. The sockets also provide a smaller pitch (0.85 mm) than DDR3 sockets and demonstrate excellent compatibility in lead-free and halogen-free processing technologies.

Molex offers 0.76 and 0.38 µm gold-plated DDR4 DIMM sockets in a combination of several housing and latch colors, PC tail lengths and PCB thicknesses. For more information please visit www.molex.com/link/ddr4.html. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register.

2014080223 / 03.08.2014 / - / Molex, LLC /
Molex ML-XT™ Sealed Connection System Delivers Market-Leading Seal Technology for the Commercial Vehicle Market
Molex ML-XT™ Sealed Connection System Delivers Market-Leading Seal Technology for the Commercial Vehicle Market
The rugged solution is ideal for critical vehicle-wiring applications in harsh environments
.....
USB 3.0 Connectors and Cable Assemblies
High-Durability Class USB 3.0 connectors and cable assemblies provide robust connectivity to support consumer applications.
.....
ML-XT™ Sealed Connection System
The rugged ML-XT™ connection system with market-leading high-performance seal technology is a cost-competitive solution offering superior reliability for marine applications in harsh environments.
.....
DuraClik™ -2.00mm Pitch Wire-to-Board Connector Family, Positive Lock
Molex’s expanded line of DuraClik™ connectors with terminal retainer options provides superior electrical contact reliability, mating retention and space savings compared to competitive versions for high-vibration and high-temperature applications.
.....
M12 Cordsets with Push-to-Lock Mating
Delivering increased productivity and cost savings, MX-PTL™ M12 Cordsets surpass the performance and reliability of traditional threaded connectors and facilitate quick connections to I/O blocks.
.....
**-3-D Custom Circuitry with MID/LDS Technology
**-Addressing functionality, space, weight and cost cencerns, Molex delivers MID/LDS 3-D selective trace solutions, providing engineering and manufacturing expertise to create customized, miniaturized connectors, antennas, sensors and more.
.....
**-EXTreme Guardian™ Power Connector System from Molex Now Available in Two-to-Six Circuit Harness Assembly Options
**-Wire-to-board solution packs high power in a small footprint for top-end server applications
.....
**-Molex and Credo to Demonstrate 50 Gbps NRZ live serial traffic at DesignCon 2015
**-Demo will utilize Molex zQSFP+™ cable assembly and zQSFP+ SMT connector interface
.....
**-Updated DDR4 DIMM Sockets from Molex Offer Multiple Improvements for Greater Flexibility and Reliability
**-High-speed server memory applications benefit from advancements in socket styles and construction material
.....
Molex LED Array Holder Provides a Solder-Free Connector for Citizen Electronics' New Chip on Board (COB) Arrays
Holder creates a solderless electrical connection between LED array and power source to simplify the installation process and provide field serviceable benefits
.....
Molex LED Array Holder Provides a Solder-Free Connector for Citizen Electronics' New Chip on Board (COB) Arrays
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IPETRONIK
Calendary
SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
productronica China, Shanghai, 20.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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