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Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market

Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market 

The innovative paste has the ideal preconditions for high-reliability applications in automotive modules, power modules or in the semiconductor industry and other fields, whose effective operation depends in heat dissipation

The Kyocera Corporation launches the innovative environmentally friendly XT2773R7 Silver Sinter Paste in Europe – a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders. Kyocera’s lead-free, pressureless Silver Sinter Paste exhibits excellent thermal and electrical performance as well as an extremely strong adhesion to bare copper. These characteristics make this new paste ideal for high-reliability applications in which heat dissipation is crucial, such as power semiconductors, automotive modules and high-brightness light emitting diodes (LEDs).

Based on the nano-silver technology, Kyocera’s Silver Sinter Paste demonstrates a thermal conductivity of more than 200 W/mK and an excellent die-shear adhesion to bare copper, silver- and gold-plated surfaces. Compared to standard solders and electrically conductive die-attach pastes, Kyocera’s Silver Sinter Paste offers more than three times the thermal conductivity. Moreover, through the utilization of a novel resin-dispersion system, the paste shows excellent interface reliability in the most demanding applications.

The semiconductor industry is making every effort to eliminate high-lead solder in its products, where feasible, due to environmental and health concerns. Many semiconductor devices serve essential safety purposes in automotive and industrial applications. Until now, high-lead alloys – which offer a high melting point and thermal conductivity – were considered necessary to guarantee the required level of reliability. By leveraging the unique properties of nano silver, Kyocera’s solution to further enhance semiconductor performance offers a low-temperature, pressureless silver solder option that enhances the performance of high-power semiconductor devices, such as gallium nitride (GaN) and silicon carbide (SiC).
Kyocera is actively engaged in the development of environmentally friendly products and strives to reduce the use of environmentally harmful materials and processes as much as possible in the industries it supports.

2016052406 / 28.05.2016 / Various / Kyocera Corporation /
Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market
Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market
The innovative molding compound stands out on account of its unrivaled 6W/mK and its high flowability. It can be applied not only to power modules, but also to BGA packages with long Cu wires.
.....
Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market
The innovative paste has the ideal preconditions for high-reliability applications in automotive modules, power modules or in the semiconductor industry and other fields, whose effective operation depends in heat dissipation
.....
Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market 
KYOCERA TCL Solar Begins Construction on 13.7MW Floating Solar Power Plant
KYOCERA TCL Solar Begins Construction on 13.7MW Floating Solar Power Plant
Company’s fourth floating solar project, world’s largest, will be built on Japan’s Yamakura Dam reservoir
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Latest in Kyocera's Dura Series is tough and waterproof, supports Sprint Direct Connect Push to Talk service
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Kyocera Launches Rugged DuraXTP Phone At Sprint Nationwide
KYOCERA Introduces TFT-LCDs with Projected Capacitive Touchscreens for Industrial Display Applications
KYOCERA Introduces TFT-LCDs with Projected Capacitive Touchscreens for Industrial Display Applications
Displays offer super high brightness, wide viewing angle and PCAP touchscreens
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IPETRONIK
Calendary
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
productronica China, Shanghai, 20.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
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Mouser Electronics Warehouse Tour with Grant Imahara
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