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Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market

Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market

The innovative molding compound stands out on account of its unrivaled 6W/mK and its high flowability. It can be applied not only to power modules, but also to BGA packages with long Cu wires.

Kyoto / Neuss - The Kyocera Corporation has recently developed a high-thermal conductivity Epoxy Molding Compound with a thermal conductivity of 6W/mK. This stands for a significant increase of the conventional thermal conductivity of 0.9-3W/mK and thus enhances the protection of semiconductor components from light, temperature, humidity, dust and physical shock.

In general, there are two approaches to reduce the thermal resistance of the semiconductor packages: Either a heat sink or a radiation fin (sometimes both are used in combination) can be applied. The alternative would be to use a molding compound with a high thermal conductivity. In case of the latter approach, the molding compound is required to have the appropriate mold shrinkage, a high adhesion strength and an excellent flowability in addition to the high thermal conductivity.

The new product has achieved an extremely high thermal conductivity by a higher alumina filler loading while excellent flowability is still maintained. Transfer moldings as well as compression moldings are available.

By using our high thermal conductivity molding compound, the thermal dispersion of packages becomes higher. Thus, it is possible to eliminate the heatsink and also easier to design the package structure.

Kyocera is actively engaged in the development of environmentally friendly products and strives to reduce the use of environmentally harmful materials and processes as much as possible in the industries it supports.

2016052407 / 02.06.2016 / Various / Kyocera Corporation /
Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market
Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market
The innovative molding compound stands out on account of its unrivaled 6W/mK and its high flowability. It can be applied not only to power modules, but also to BGA packages with long Cu wires.
.....
Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market
The innovative paste has the ideal preconditions for high-reliability applications in automotive modules, power modules or in the semiconductor industry and other fields, whose effective operation depends in heat dissipation
.....
Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market 
KYOCERA TCL Solar Begins Construction on 13.7MW Floating Solar Power Plant
KYOCERA TCL Solar Begins Construction on 13.7MW Floating Solar Power Plant
Company’s fourth floating solar project, world’s largest, will be built on Japan’s Yamakura Dam reservoir
.....
Kyocera Launches Rugged DuraXTP Phone At Sprint Nationwide
Latest in Kyocera's Dura Series is tough and waterproof, supports Sprint Direct Connect Push to Talk service
.....
Kyocera Launches Rugged DuraXTP Phone At Sprint Nationwide
KYOCERA Introduces TFT-LCDs with Projected Capacitive Touchscreens for Industrial Display Applications
KYOCERA Introduces TFT-LCDs with Projected Capacitive Touchscreens for Industrial Display Applications
Displays offer super high brightness, wide viewing angle and PCAP touchscreens
.....
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Calendary
IFA Berlin 2016, DE, 31.8.-5.9.2018 - consumer electronics unlimited
IMTS2018, Chicago, IL, 10.-15.9.2018
Mobile World Congress Americas 2018, 12.-14.9.2018, Los Angeles
electronica India, Bengaluru, India, 26.-28.9.2018
21st Manufacturing World Osaka, JPN, 3.-5.10.2018
Global sources Consumer Electronics Hong Kong, 11.-14.10.2018
Hong Kong Electronics Fair, 13.-16.10.2018
electronicAsia, Hong Kong, 13.-16.10.2018
Hong Kong International Lighting Fair, 27.-30.10.2018
NEPCON West China, Cheng Du, 7.-9.11.2018
electronica 2018, Munich, DE, 13.-16.11.2018
SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
productronica China, Shanghai, 20.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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