Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

28.03.2024 11:53:01
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.

 This is especially interesting for operators of 5G networks and edge data centers, who expect real-time performance demands to increase once 10GbE infrastructures become deployed more widely, leading to constantly lower revenues per processed data volume. Also, all IIoT, Industry 4.0 and fog server applications will require continuous performance upgrades as security, analytics and artificial intelligence demands will keep evolving for at least a decade to come. 

 “Building a 10GbE infrastructure with IIoT, fog or Industry 4.0 servers and 5G small cells at the edges for decentralized decision making in real time is only the first step”, explains Martin Danzer, Director of Product Management at congatec. “Once this infrastructure is established, the performance of these nodes will have to constantly increase as we are only at the beginning of designing such decentralized 10GbE node technologies and the demand for transcoding, security, data capture and analytics capabilities as well as artificial intelligence and real-time communication will continue to grow dramatically.”

The congatec micro server carrier board in detail

The edge server board in the 5x5 Mini-STX form factor provides impressively high performance thanks to utilizing the COM Express Type 7 conga-B7AC module based on the Intel® Atom™ C3000 processor. With processor power consumption starting at just 11W TDP, the system offers 4x real-time 10GbE network performance and up to 16 cores, which is ideal for processing many smaller packet sizes in parallel. Compared to other multi-core solutions, such as the Intel® Xeon® D processors, the costs and power consumption here are significantly lower; this makes it possible to roll out very high network bandwidths and storage capacities far into the industrial field.

The congatec micro server carrier board can be equipped with eight different Intel® Atom™ server processor versions – from the 16-core Intel® Atom™ C3958 to the quad-core C3508 processor for the extended temperature range ( 40°C to +85°C). All offer up to 48GB of fast 2400 DDR4 memory, which can be designed with or without Error Correction Code (ECC) depending on customer requirements. The 10GbE interfaces are standardly implemented via SFP+ cages, enabling network connection via both fiber optic and copper cables. In addition, the carrier board provides 2x 1GbE and 2x USB 3.0 interfaces for service and peripherals. One of the 1GbE ports is connected to the integrated board management controller and can therefore be used for server-typical remote management tasks.

The congatec micro server carrier board in the 5x5 Mini-STX form factor further offers a VGA output and a serial interface for local administration. For custom extensions, it provides three M.2 slots. Two of them are designed for M.2 2280 cards with key M and 4 PCIe lanes or 1x SATA, which makes them particularly suitable for storage media. The third M.2 slot accepts M.2 3042 cards with key A. With 2x PCIe, 1x USB 3.0 and I²C, it can connect both storage media and other peripherals. The feature connectors also provide GPIOs, I²C, SM and LPC buses. 

If the Server-on-Modules require active cooling – for example, with a 16-core Intel® Xeon® D processor – optional CPU and system fans can also be supported and controlled. This means the congatec micro server carrier board in the 5x5 Mini-STX form factor offers the same server-class performance that up to now only fully-featured 19 in rackmount servers were able to provide. Today, they can be mounted anywhere and even integrated into autonomous vehicles. Customizing of this hardware platform to fulfill specific demands is possible. 

The micro server carrier board in the 5x5 Mini-STX form factor fits perfectly to the COM Express Type 7 conga-B7AC module that can be installed with following processor versions:

Processor Cores Smart Cache [MB] Clock [GHz] TDP [W]
Intel® Atom™ C3958 16 16 2.0 31
Intel® Atom™ C3858 12 12 2.0 25
Intel® Atom™ C3758 8 16 2.2 25
Intel® Atom™ C3558 4 8 2.2 16
Intel® Atom™ C3538 4 8 2.1 15
Intel® Atom™ C3808 12 12 2.0 25
Intel® Atom™ C3708 8 16 1.7 17
Intel® Atom™ C3508 4 8 1.6 11.5

More information about suitable COM Express type 7 modules is available on the product page https://www.congatec.com/en/products/com-express-type-7.html

2018031601 / 16.03.2018 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813