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AR236.B & AR232.B
 
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Power Integrations Unveils High-Efficien

Easily Implement Low-power Touch Pads with Surface Gestures Using Microchip’s New Software Library

Easily Implement Low-power Touch Pads with Surface Gestures  Using Microchip’s New Software Library 

Add taps, swipes, pinch and zoom to compatible PIC®, AVR® and SAM MCUs at no additional cost

CHANDLER, Ariz., May 21, 2018 — Capacitive touch has become ubiquitous across a wide range of industries and applications, replacing the knobs and buttons that once controlled our electronics with smooth, intuitive touch panels. Previously a novelty on high-end products, consumers now expect touch control on everyday devices such as headphones, remote controls, coffee makers and thermostats without paying a premium for the interface. Microchip Technology Inc. (NASDAQ: MCHP) today announced a new 2D Touch Surface library that enables designers to easily implement touch pads using the company’s 8-bit PIC® and AVR® microcontrollers (MCUs) and 32-bit SAM MCUs. Available free of charge with the purchase of any compatible MCU, the library provides a simplified, low-cost solution for embedded applications.

Ideal for implementing small touch pads and screens, the 2D Touch Surface library eliminates costs by running on a device’s existing MCU. This removes the need for a dedicated touch controller, giving product designers the flexibility to add finger position tracking and gesture detection, such as swipes, pinch and zoom, to products. The touch library is provided through Microchip’s code configurators: MPLAB® Code Configurator (MCC) for PIC MCUs and Atmel START for AVR and SAM MCUs. Both software tools enable simplified graphical configuration and accelerate development with lean C code tailored for individual project needs. The 2D Touch Surface library is available today on Atmel START and will be available on MCC this quarter.

Intuitive, attractive user interfaces are central to the success of products, and the 2D Touch Surface library eliminates the need to integrate a costly operating system to fulfill consumers’ smartphone-like interface expectations. The library is well suited for adding touch to a variety of applications across consumer electronics, automotive and industrial industries, such as smart speakers, steering wheels or thermostats.

“Capacitive touch has become mainstream, and we’re continuing to see growth in the number of applications that require low-power, gesture-enabled touch surfaces,” said Fanie Duvenhage, vice president of Microchip’s touch and gesture business unit. “The 2D Touch Surface library makes the realization of small touch pads and screens easier and more affordable.”

Low-power performance for touch pads is built in through the library, as complete surfaces are scanned at once while in deep sleep. Reliability is a fundamental requirement for touch, and the solution provides continued responsiveness and functionality through the impact of water and noise, meeting the demands of automotive and home appliance applications. Implementations operate through wet conditions and can sustain 10V in conducted noise, in alignment with International Electrotechnical Commission (IEC) 6100-4-6 test level 3.

Development Tools

The DM080101 Water Tolerant Touch Surface development kit enables easy evaluation of the 2D Touch Surface library. The kit demonstrates water tolerance and noise immunity on a touch pad and has two touch buttons, all controlled by the same MCU.

Pricing and Availability

The 2D Touch Surface library is available for free with the purchase of any compatible MCU. The DM080101 Water Tolerant Touch Surface development kit is available now for $23.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s website. To purchase products mentioned in this press release, go to Microchip’s full-service channel microchipDIRECT or contact one of Microchip’s authorized distribution partners.

2018052702 / 27.05.2018 / Electronic-components / Microchip Technology Inc. /

Reduce Production Costs and Time to Market with Industry’s First  
Reduce Production Costs and Time to Market with Industry’s First NOR Flash Memory Devices Featuring Embedded MAC Addresses
With no minimum order requirement, Microchip’s new family of memory devices offers pre-programmed MAC addresses for companies of all sizes
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Microchip Introduces First Clock Buffers to Meet DB2000Q/QL Standards Plus PCIe Gen 4 and Gen 5 Low Jitter Specifications
20-output PCIe clock buffer is ideal for next-generation servers, data centers, storage devices and other PCIe applications
.....
Microchip Introduces First Clock Buffers to Meet DB2000Q/QL Standards  
Accelerate EMI Qualification of Automotive Touchscreens with New Capacitive Touch Controllers 
Accelerate EMI Qualification of Automotive Touchscreens with New Capacitive Touch Controllers
maXTouch® TD family of touchscreen controllers significantly increases signal-to-noise ratio in nine- to 20-inch touchscreens
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Fast Data Rates Meet High Accuracy in Microchip’s New Analog-to-Digital Converter Families
With data rates of up to 153.6 kSPS and a compact package size, the 24-bit and 16-bit ADCs improve system performance in high precision applications
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Fast Data Rates Meet High Accuracy in Microchip’s 
Single-Port USB Smart Hub ICs Optimize System Costs for Automotive Manufacturers 
Single-Port USB Smart Hub ICs Optimize System Costs for Automotive Manufacturers
As demand for in-vehicle entertainment and smartphone applications continues to grow, automotive manufacturers must provide dependable and convenient connectivity in designs — all while optimizing system costs.
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Preserve Legacy Low Pin Count (LPC) Investments with the Industry’s First Commercial eSPI to LPC Bridge
Device allows industrial computing developers to integrate the eSPI standard in existing equipment, minimizing development costs and extending product lifecycles
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Preserve Legacy Low Pin Count (LPC) Investments 
Industry’s first terabit-scale Ethernet PHY
Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity
Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.
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Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems
Microchip Technology Inc., via its Microsemi subsidiary, announces a cost-effective eight-port Power over Ethernet (PoE) switch which provides guaranteed power of 60 Watts (W) per port for all eight ports simultaneously. Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design.
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Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
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.....
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Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
.....
Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
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Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications
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Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
.....
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
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New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
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SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
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productronica 2019, Munich, DE, 12.-15.11.2019
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IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
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Mouser Electronics Warehouse Tour with Grant Imahara
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