HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Interesting video
Various
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
Tektronix AFG31000
 
Tektronix Redefines the Arbitrary/Functi
Ingenia Ambition X 1.5T MR
 
Philips launches Ingenia Ambition X 1.5T
VOMA617A
 
VOMA617A AEC-Q101 Qualified Optocouplers
ISOCELL Slim 3P9
 
Samsung Makes Image Sensor Integration E
SSD NVMe 970 PRO
 
Samsung Electronics Sets New Performance
Samsung PRO Endurance
 
Samsung Electronics Redefines High Endur
CFast 2.0
 
Sony completes Pro memory card line-up w
DC Micro Motor
 
DC Micro Motor Series
AQV252G3S
 
High Power SOP PhotoMOS

Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology

Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology 

Bluetooth 5-compliant SoC enables immersive audio sound in Audeze’s award-winning, high-end Mobius gaming headphones

With mainstream consumer demand for high-quality audio experiences growing, consumers expect Bluetooth audio devices to create an immersive and uninterrupted listening experience. However, Bluetooth audio designs are often limited by the bit depth and frequency rate of existing codecs, which are the communication and compression technology used to send audio over the air. Now designers of audio systems have a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology* in the IS2064GM-0L3 from Microchip Technology Inc. (NASDAQ: MCHP). The SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products. Upscale headphone manufacturer, Audeze, has implemented the SoC into their high-end Mobius gaming headphone. For more information on the SoC visit: http://www.microchip.com/IS2064.

The Audeze Mobius headphone utilizes Microchip’s IS2064GM-0L3 SoC for the Bluetooth wireless connection supporting LDAC and other audio codec interfaces. Sony's LDAC is considered the highest-quality audio codec available. It transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices.

“Our new Mobius headphone features many groundbreaking technologies. To ensure high-quality Bluetooth audio we implemented Microchip’s IS2064GM-0L3 SoC in our headphones,” said Sankar Thiagasamudram, CEO of Audeze. “Thanks to the outstanding support from Microchip, we were able to incorporate the LDAC codec quickly and easily into our products.”

The IS2064GM-0L3 SoC not only makes the LDAC codec available to the broader market of audio product vendors, it also allows customers to utilize Microchip’s outstanding global technical support and comprehensive development environment to assist customers with implementation and getting to market faster. The LDAC codec is also integrated into the Android 8.0 Oreo™ operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.

“Microchip enables OEMs to address consumers’ increasing demand for high-quality audio with the convenience and ubiquity of Bluetooth wireless,” said Steve Caldwell, vice president of Microchip’s wireless solutions group. “OEMs can focus on their audio product and sound quality and know that, because of Microchip, the Bluetooth wireless integration will be seamless.”

Development Tools

The IS2064GM-0L3 is available to customers upon request after approval. Development boards are also available.

Pricing and Availability

The IS2064GM-0L3 comes in an 8 x 8 mm LGA package and is available for volume production starting at $4.90 each in 10,000-unit quantities. Please contact Sony for additional licensing requirements when using LDAC technology: www.sony.net/Products/LDAC/index.html.

For additional information, contact any Microchip sales representative, visit Microchip’s website or send an email to BTAudio@microchip.com. To learn more about Microchip’s complete line of Bluetooth audio products, visit Microchip’s Bluetooth Audio Design Center.

2018080502 / 05.08.2018 / Electronic-components / Microchip Technology Inc. /
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO 
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs
.....
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components
Flexible solution covers a wide frequency range without requiring an external crystal
.....
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components 
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family 
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family
Measure temperature fluctuation with industry’s first rate-of-change reporting feature
.....
Create Secure Connected Applications in a Single Click with Microchip’s AVR MCU Development Board for Google Cloud
New solution enables developers to easily deploy IoT devices to Google Cloud IoT Core’s artificial intelligence and machine learning infrastructure
.....
Create Secure Connected Applications in a Single Click with  
AVR Microcontrollers Now Supported in MPLAB X Integrated Development Environment 
AVR Microcontrollers Now Supported in MPLAB X Integrated Development Environment
Developers new to the AVR architecture can easily begin designs with a unified development platform that crosses multiple operating systems
.....
New Digital Signal Controller (DSC) Accelerates DSP Performance for Time-Critical Control Applications
dsPIC33CK is Microchip’s highest performance single-core DSC in an ultra-small package
.....
New Digital Signal Controller (DSC) Accelerates DSP Performance for Time-Critical Control Applications
Protect In-vehicle Networks from Hackers with the Industry’s First Automotive Security Development Kit 
Protect In-vehicle Networks from Hackers with the Industry’s First Automotive Security Development Kit
CryptoAutomotive™ development kit provides OEMs and Tier 1 suppliers with tools to secure existing automotive networks
.....
Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
Bluetooth 5-compliant SoC enables immersive audio sound in Audeze’s award-winning, high-end Mobius gaming headphones
.....
Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology 
Maximize System Performance with Microchip’s Dual-mode Power Monitoring IC 
Maximize System Performance with Microchip’s Dual-mode Power Monitoring IC
Single IC offers industry-leading accuracy for real-time power measurement of AC and DC power supplies
.....
Reduce Costs and Bill of Materials with Single Power Monitoring IC that Measures Power from 0V to 32V
Improve accuracy using industry’s first two-channel device with native 16-bit resolution
.....
Reduce Costs and Bill of Materials with Single Power Monitoring IC that Measures Power from 0V to 32V 
Increase Functionality in Sensor Nodes with New 8-bit tinyAVR® MCUs 
Increase Functionality in Sensor Nodes with New 8-bit tinyAVR® MCUs
ATtiny3217 and ATtiny3216 join Microchip’s tinyAVR family with largest memory in the series
.....
Reduce Driver Distraction with Automotive-Qualified 3D Gesture Recognition Controller
Decrease automotive 3D HMI design costs with Microchip’s new gesture controller
.....
Reduce Driver Distraction with Automotive-Qualified 3D Gesture Recognition Controller  
Create Secured IoT Endpoints with the First 32-bit MCU to Feature Robust, Chip-level Security and Arm TrustZone Technology 
Create Secured IoT Endpoints with the First 32-bit MCU to Feature Robust, Chip-level Security and Arm TrustZone Technology
New MCUs combine industry’s best-in-class low power consumption and water-tolerant, noise-immune capacitive touch
.....
Design Code Separately and Integrate Seamlessly with Dual-core dsPIC Digital Signal Controller
dsPIC33CH family optimized for high-performance and time-critical, real-world embedded control
.....
Design Code Separately and Integrate Seamlessly with Dual-core dsPIC Digital Signal Controller 
Simplify the Development of Secure Connected Nodes 
Simplify the Development of Secure Connected Nodes Using Cryptography-Enabled Microcontroller with DICE Architecture
Easily create secure connected devices with new development kit for Microsoft Azure
.....
Streamline Deployment of Smart Energy Equipment with Flexible Power Line Communication (PLC) Modem
Multi-protocol modem offers single design that addresses a variety of smart metering markets and requirements
.....
Streamline Deployment of Smart Energy Equipment with Flexible  
Increase System Performance in Closed-loop Control Applications  
Increase System Performance in Closed-loop Control Applications with New PIC® and AVR® MCUs
New PIC® and AVR® MCUs Create more efficient systems with Core Independent Peripherals
.....
Easily Implement Low-power Touch Pads with Surface Gestures Using Microchip’s New Software Library
Add taps, swipes, pinch and zoom to compatible PIC®, AVR® and SAM MCUs at no additional cost
.....
Easily Implement Low-power Touch Pads with Surface Gestures  Using Microchip’s New Software Library 
Company of the week

Taiwan Semiconductor
Address Book


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


Foremost Electronics


RS Components GmbH


SECTRON


FAULHABER


Willow Technologies


ABB


Visual Communications Company, LLC


ACS Motion Control


LASER COMPONENTS


Transfer Multisort Elektronik Sp. z o.o.


Hradil Spezialkabel GmbH


Sonderhoff Holding GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


LEM


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET


LG Innotek


PANDUIT


GaN Systems


IPETRONIK
Calendary
SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
productronica China, Shanghai, 20.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813