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Nexperia announces smallest logic package that can be used without a step-down mask

Nexperia announces smallest logic package that can be used without a step-down mask

Nexperia announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.

Nexperia developed the X2SON packages - part of its MicroPak package range - to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only needed under that threshold). The company’s low-power AUP, AXP, LV and LVC technology families covering over one hundred logic solutions are now available in X2SON 8, 6, 5 and 4-pin packages.

The new 4-pin X2SON4 package option reduces the footprint of the same function by 44% when compared to 5-pin X2SON5, and by up to 64% when compared to XSON packages.

Michael Lyons, senior product manager at Nexperia commented: “X2SON4 enables the release of smaller buffers and inverters, that were previously only available in 5-pin or 6-pin leadless packages. All our X2SON solutions enable miniaturization without the use of expensive and fragile step down masks.”

As packages become smaller, the pad pitch is reduced – making the use of standard assembly tools difficult. If the pitch is reduced to less than 0.4mm, thinner and delicate step down masks (stencils) are required to apply solder paste. They typically need to be replaced regularly, may also require a different, more expensive solder paste, and the placement of components may be restricted because the mask won’t work over the entire board.

X2SON packages from Nexperia require no step-down mask, thus saving manufacturing costs. In addition, the X2SON’s larger pad pitch provides greater contact area, resulting in easier component placement, as well as improved joint strength and robustness. Larger pad pitches make it easier to avoid costly assembly problems such as misaligned components, and reduce the risk of short circuits. 

The new future-proof X2SON4 logic package also features a low 0.32mm profile and low 0.6mm width and length, suiting space-constrained, portable applications such as IoT, wearables and consumer electronics. Devices are RoHS & dark-green compliant with NiPdAu leadframe finish. Ten AUP and LVC logic buffers / inverters are currently available from Nexperia in the new X2SON4 (SOT1269-2) package. For more information on Nexperia’s portfolio in X2SON packages click here or download the leaflet here. Get datasheets here from the “Products” tab.

2018082803 / 28.08.2018 / Electronic-components / NEXPERIA /
Nexperia MOSFETs deliver Best-In-Class Safe Operating Area and improved RDS(on) for Hot Swap designs
Nexperia MOSFETs deliver Best-In-Class Safe Operating Area and improved RDS(on) for Hot Swap designs
Ensures no compromise between protection and operating efficiency
.....
New 175°C AEC-Q101 MOSFETs in miniature leadless packages from Nexperia enable automated inspection
Nexperia announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175 °C and are available in the AOI-compatible DFN2020 package (DFN = Discrete Flat No leads). More, the new devices measure just 2 mm x 2 mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.
.....
New 175°C AEC-Q101 MOSFETs in miniature leadless packages from Nexperia enable automated inspection
Nexperia announces smallest logic package that can be used without a step-down mask
Nexperia announces smallest logic package that can be used without a step-down mask
Nexperia announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.
.....
Nexperia’s new ESD protection series for USB Type-C deliver industry’s highest surge robustness and lowest trigger voltage
Nexperia announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the system chip.
.....
Nexperia’s new ESD protection series for USB Type-C deliver industry’s highest surge robustness and lowest trigger voltage
New LFPAK56 MOSFETs from Nexperia feature improved creepage and clearance, meeting UL2595
New LFPAK56 MOSFETs from Nexperia feature improved creepage and clearance, meeting UL2595
Nexperia announced that two of its LFPAK56-packaged portfolio of MOSFETs are now available with improved creepage and clearance to meet UL2595 requirements for battery-powered equipment rated between 15 and 32 V.
.....
Nexperia launches lowest RDS(on) automotive MOSFETs down to 0.9 mΩ
Nexperia announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40 V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices.
.....
Nexperia launches lowest RDS(on) automotive MOSFETs down to 0.9 mΩ
Nexperia opens significant expansion at Guangdong Assembly and Test facility
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Nexperia today formerly opened a significant expansion to its ATGD discrete semiconductor assembly and test plant in Guangdong, China. The total production and warehouse site now covers an area of around 72,000 square meters, adding an extra 16,000 square meters of production space.
.....
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Nexperia, the former Standard Products division of NXP, today announced its NextPower 100 V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package.
.....
NextPower 100V power MOSFETs from Nexperia feature low Qrr, and high 175°C rating
Single output Logic dividers from Nexperia deliver space-saving of up to 93% for superior system efficiency 
Single output Logic dividers from Nexperia deliver space-saving of up to 93% for superior system efficiency
Nexperia, the former Standard Products division of NXP, today announced a new range of AHC (Advanced High speed CMOS) dividers with oscillators that save space, increase efficiency and reduce overall system cost. This new 74AHC1G42xx dividers range also offers -for the first time- overvoltage-tolerant inputs for mixed voltage mode operation, increasing reliability and flexibility in designs.
.....
Nexperia launches broad range of space-saving PN and Trench Schottky rectifiers
Nexperia, the former Standard Products division of NXP, today announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the clip-bonded FlatPower (CFP) packages.
.....
Nexperia launches broad range of space-saving PN and Trench Schottky rectifiers
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SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
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PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
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productronica China, Shanghai, 20.-22.3.2019
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HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
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