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Texas Instruments will show what’s next for automotive electronics and industrial automation at electronica 2018

Texas Instruments will show what’s next for automotive electronics 

Visit TI at electronica 2018, November 13-16, hall C4, booth 131

FREISING, Germany (Sept. 4, 2018) – At electronica 2018 in Munich, Germany, Texas Instruments (TI) will reveal how it is “designing tomorrow” for the automotive and industrial markets through advancements in analog and embedded processing integrated circuits (ICs). TI will showcase technology for the future of smart driving, smart buildings and smart factories with interactive demonstrations and presentations. Visitors will also have the chance to sit down with TI engineering experts to learn about the company’s latest groundbreaking innovations.

Smart driving

Automobile designers want technologies that maximize the driving distance per charge, improve vehicle perception and driver visibility, and enhance passenger comfort and convenience. Attendees will interact with the latest automotive innovations at electronica, where TI will present advancements for vehicle electrification, the digital cockpit, the connected car, autonomous driving technology and more. The demonstration will highlight innovation for off- and on-board charging of electric vehicles (EVs), lighting, interior body sensors, and advanced driver-assistance systems (ADAS).

Smart buildings

Companies continue to add more electronics to building designs to make them smarter, safer, more efficient and more connected. Attendees will experience the latest building automation innovations at electronica, where TI will show how companies can incorporate intelligent detection, using next-generation sensing capabilities and connectivity technology that supports multiple wireless protocols, including Bluetooth®, Thread®, Zigbee®, WiFi® and more.

Smart factories

As Industrial IoT becomes prevalent in factory designs, manufacturers need smarter technologies to help predict, detect and transmit data to the cloud and from machine to machine. In TI’s Industry 4.0 demonstration area, visitors will be able to see what’s next in industrial automation, robotics, predictive maintenance, machine vision and more. Visit the TI booth to try out new products and fully tested reference designs, including real-time time-sensitive network (TSN) technology, TI mmWave sensing and IO-Link communication.

Powering, controlling, sensing, connecting and more…

Attendees will be able to take part in an engineer-to-engineer experience with TI experts at four technology workbenches, featuring power management, sensors, wireless connectivity, MCUs and processors. For example, TI engineers will showcase GaN technology innovation for power design, ultrasonic sensing, and hands-on demonstrations featuring TI’s SimpleLink™ MCU products.

Beyond the TI booth at electronica

Visitors can also learn from TI experts in one or all of the following presentations at the show.

Wednesday, November 14:

  • “Industry 4.0 embedded processor platform with integrated time sensitive network (TSN),” by Thomas Leyrer, applications manager for factory automation systems.
  • “Multi-protocol wireless communication,” by Ben Gilboa, , low-power RF system engineer, and Priya Thanigai, low-power RF marketing manager.
  • “IoT – Low-power embedded WiFi,” by Uri Weinrib, MCU applications engineer.
  • “Sensor-to-Cloud connection made simple with intelligent gateway,” by Sai Reddy, MCU applications engineer.
  • “More than just car talk: How automotive technology is scaling to industrial vehicles,” by Prajakta Desai, product marketing manager for industrial radar.

Thursday, November 15:

  • “Implementing a secure OTA update application for wireless MCU devices,” by Nicholas Lethaby, MCU systems engineer.
  • Tech Talks session: Industrial IoT panel with Miro Adzan, general manager for TI’s factory automation systems.

Follow us for updates

Follow TI at @TXInstrumentsEU on Twitter and other social media channels using #TIele18 for the latest updates about TI at electronica.

Texas Instruments will show what’s next for automotive electronics 
Texas Instruments will show what’s next for automotive electronics and industrial automation at electronica 2018
Visit TI at electronica 2018, November 13-16, hall C4, booth 131
.....
New robust, noise-immune capacitive-sensing MCUs from TI bring touch control to cost-sensitive industrial applications
MSP430™ microcontrollers with CapTIvate™ technology offer value and performance to applications exposed to electromagnetic disturbances, oil, water and grease
.....
New robust, noise-immune capacitive-sensing MCUs from TI bring touch control to cost-sensitive industrial applications
Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent
Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent
Modules from Texas Instruments feature tiny MicroSiP packaging and achieve up to 92 percent efficiency
.....
Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs
TI's new operational amplifier and comparators reduce overall system footprint in IoT, personal electronics and industrial applications
.....
Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs
TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support
TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support
Texas Instruments today introduced a pair of highly flexible, single-chip buck-boost battery charge controllers for one- to four-cell (1S to 4S) designs. The bq25703A and bq25700A synchronous charge controllers support efficient charging through USB Type-C and other USB ports in end equipment ranging from notebooks and tablets to power banks, drones and smart home applications.
.....
New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communication
Sitara™ AMIC110 system on chip (SoC) simplifies industrial Ethernet communication and provides design versatility by supporting more than 10 standards
.....
New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communication
TI technology extends flight time and battery life of quadcopters and industrial drones
TI technology extends flight time and battery life of quadcopters and industrial drones
New reference designs feature latest innovation in battery management and motor control efficiency
.....
Texas Instruments is engineering industrial and automotive innovation at electronica 2016
Visit TI at electronica 2016, November 08-11, hall A4, booth 219
.....
Texas Instruments is engineering industrial and automotive innovation 
TI introduces chokeless high-speed CAN transceiver families with industry-leading EMC performance
TI introduces chokeless high-speed CAN transceiver families with industry-leading EMC performance
New industrial and automotive interface devices provide leading combination of protection and compliance
.....
TI introduces industry’s highest-performance wideband RF phase-locked loops with integrated voltage-controlled oscillators
Wide frequency range of up to 9.8 GHz and best phase noise performance reduce system complexity
.....
TI introduces industry’s highest-performance wideband RF phase-locked loops 
TI drives high-voltage batteries with industry's first 100-V high-side FET driver
TI drives high-voltage batteries with industry's first 100-V high-side FET driver
Unprecedented flexibility and power protection for advanced industrial battery applications
.....
TI introduces the industry's highest-performance audio operational amplifier
Lowest distortion and noise, high linear output current, and low power push the boundaries for professional and portable audio
.....
TI introduces the industry's highest-performance audio operational amplifier
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IPETRONIK
Calendary
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
productronica China, Shanghai, 20.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
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