HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Interesting video
Various
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien

Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family

Accelerate Development of Remote IoT Nodes with the 

With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life

LoRa® (Long Range) technology is extending the reach of the Internet of Things (IoT) by combining long-range wireless connectivity with low-power performance. To accelerate the development of LoRa-based connected solutions, Microchip Technology Inc. (Nasdaq: MCHP) today introduced a highly integrated LoRa System-in-Package (SiP) family with an ultra-low-power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver and software stack. The SAM R34/35 SiPs come with certified reference designs and proven interoperability with major LoRaWAN™ gateway and network providers, significantly simplifying the entire development process with hardware, software and support. The devices also provide the industry’s lowest power consumption in sleep modes, offering extended battery life in remote IoT nodes.

Most LoRa end devices remain in sleep mode for extended periods of time, only waking up occasionally to transmit small data packets. Powered by the ultra-low-power SAM L21 Arm® Cortex®-M0+ based MCU, the SAM R34 devices provide sleep modes as low as 790 nA to significantly reduce power consumption and extend battery life in end applications. Highly integrated in a compact 6 x 6 mm package, the SAM R34/35 family is ideal for a broad array of long-range, low-power IoT applications that require small form factor designs and multiple years of battery life.

In addition to ultra-low-power consumption, the simplified development process means developers can accelerate their designs by combining their application code with Microchip’s LoRaWAN stack and quickly prototype with the ATSAMR34-XPRO development board (DM320111), which is supported by the Atmel Studio 7 Software Development Kit (SDK). The development board is certified with the Federal Communications Commission (FCC), Industry Canada (IC) and Radio Equipment Directive (RED), providing developers with the confidence that their designs will meet government requirements across geographies.

LoRa technology is designed to enable low-power applications to communicate over longer ranges than Zigbee®, Wi-Fi® and Bluetooth® using the LoRaWAN open protocol. Ideal for a range of applications such as smart cities, agricultural monitoring and supply chain tracking, LoRaWAN enables the creation of flexible IoT networks that can operate in both urban and rural environments. According to the LoRa Alliance™, the number of LoRaWAN operators has doubled from 40 to 80 over the last 12 months, with more than 100 countries actively developing LoRaWAN networks.

“The LoRa ecosystem is entering a phase of accelerated growth, and as a founding member of the LoRa Alliance, Microchip has been a strong driving force to build the success of this technology,” said Steve Caldwell, vice president of Microchip’s Wireless Solutions business unit. “The SAM R34 continues Microchip’s reputation as a one-stop shop for small, low-power devices that bring the benefits of free software, excellent customer support and dependable supply.”

The SAM R34/35 family is supported by Microchip’s LoRaWAN stack, as well as a certified and proven chip-down package that enables customers to accelerate the design of RF applications with reduced risk. With support for worldwide LoRaWAN operation from 862 to 1020 MHz, developers can use a single part variant across geographies, simplifying the design process and reducing inventory burden. The SAM R34/35 family supports Class A and Class C end devices as well as proprietary point-to-point connections.

Pricing and Availability

Microchip’s SAM R34/35 LoRa family is available in six device variants, providing developers the flexibility to choose the best combination of memory and peripherals for their end application. SAM R34 devices in a 64-lead TFBGA package begin at $3.76 each in 10,000-unit quantities. SAM R35 devices are available without a USB interface starting at $3.66 each in 10,000-unit quantities.

For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here, visit Microchip’s purchasing portal or contact an authorized distributor.

2018112003 / 20.11.2018 / Electronic-components / Microchip Technology Inc. /

Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.
.....
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
.....
Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
.....
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
.....
New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
New devices give customers established supply, worldwide support, design review services and fully released drivers
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries
CryptoAuthentication™ device and managed LoRa join servers enable developers to deploy secure connected applications on LoRaWAN™ networks
.....
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering
Wide operating range and on-chip EMI filtering minimizes the increasing influence of high-frequency interference
.....
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
20-inch Automotive Touchscreens Enabled by New Single-chip  
20-inch Automotive Touchscreens Enabled by New Single-chip maXTouch Touchscreen Controllers from Microchip
New controllers support thick cover lenses with multi-finger touch and address automotive functional safety requirements
.....
Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life
.....
Accelerate Development of Remote IoT Nodes with the 
INICnet Technology Simplifies Automotive Infotainment Networking  
INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
.....
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs
.....
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO 
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components 
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components
Flexible solution covers a wide frequency range without requiring an external crystal
.....
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family
Measure temperature fluctuation with industry’s first rate-of-change reporting feature
.....
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family 
Company of the week

TE Connectivity
Address Book


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


Foremost Electronics


RS Components GmbH


SECTRON


FAULHABER


Willow Technologies


ABB


Visual Communications Company, LLC


ACS Motion Control


LASER COMPONENTS


Transfer Multisort Elektronik Sp. z o.o.


Hradil Spezialkabel GmbH


Sonderhoff Holding GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


LEM


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET
Calendary
LIGHTFAIR 2019, Philadelphia, PA USA, 21.5.-23.5.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
MWC Shanghai 2019, 26.6.-28.6.2019
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813