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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien

Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core

Connect PIC® MCU Applications to Google Cloud in Minutes with  

Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs

From coffee makers to thermostats to irrigation systems, PIC microcontrollers (MCU) are at the heart of millions of embedded applications. As developers migrate next-generation PIC MCU-based applications to the cloud, they currently must overcome complexities associated with communications protocols, security and hardware compatibility. To accelerate the development of these applications, Microchip Technology Inc. (Nasdaq: MCHP) today announced a new Internet of Things (IoT) rapid development board for Google Cloud IoT Core that combines a low-power PIC® microcontroller (MCU), CryptoAuthentication™ secure element IC and fully certified Wi-Fi® network controller. The solution provides a simple way to connect and secure PIC MCU-based applications, removing the added time, cost and security vulnerabilities that come with large software frameworks and Real Time Operating Systems (RTOS). Once connected, Google Cloud IoT Core provides powerful data and analytics to help designers make better, smarter products.  

As part of Microchip’s extended partnership with Google Cloud, the PIC-IoT WG Development Board enables PIC MCU designers to easily add cloud connectivity to next-generation products using a free online portal at www.PIC-IoT.com. Once connected, developers can use Microchip’s MPLAB® Code Configurator (MCC) rapid development tool to develop, debug and customize their application. The board combines smart, connected and secure devices to enable designers to create connected applications in minutes, including:

  • eXtreme Low-Power (XLP) PICMCU with integrated Core Independent Peripherals: Ideal for battery-operated, real-time sensing and control applications, the PIC24FJ128GA705 MCU provides the simplicity of the PIC architecture with added memory and advanced analog integration. With the latest Core Independent Peripherals (CIPs) designed to handle complex applications with less code and decreased power consumption, the device provides the ideal combination of performance with extremely low power consumption.
  • Secure element to protect the root of trust in hardware: The ATECC608A CryptoAuthentication device provides a trusted and protected identity for each device that can be securely authenticated. ATECC608A devices come pre-registered on Google Cloud IoT Core and are ready for use with zero-touch provisioning.
  • Wi-Fi connectivity to Google Cloud: The ATWINC1510 is an industrial-grade, fully certified IEEE 802.11 b/g/n IoT network controller that provides an easy connection to an MCU of choice via a flexible SPI interface. The module relieves designers from needing expertise in networking protocols.

“Microchip continues to introduce new rapid development tools that enable PIC MCU designers to meet changing application requirements and create differentiated products,” said Steve Drehobl, vice president of Microchip’s 8- and 16-bit MCU business units. “As designers add cloud connectivity and migrate their applications to the Internet of Things (IoT), our PIC-IoT WG development board provides a simplified development process to bring designs to market quickly.”

Google Cloud IoT Core provides a fully managed service that enables designers to easily and securely connect, manage and ingest data from devices at a global scale. The platform collects, processes and analyzes data in real time to enable designers to improve operational efficiency in embedded designs.

“The PIC-IoT WG development board provides Google Cloud IoT customers another option to accelerate the development of cloud-connected applications, without compromising on security,” said Antony Passemard, Head of Product Management for Google Cloud IoT. “Combined with Google Cloud Platform’s network infrastructure and Google’s IoT services, the simplicity of the board makes powerful analytics tools and unique machine learning capabilities accessible to anyone.”

The PIC-IoT WG development board joins the recently announced AVR-IoT WG development board, giving designers the flexibility to easily create cloud-connected applications with their preferred MCU architecture.  

2019022401 / 01.03.2019 / Test & measurement / Microchip Technology Inc. /

Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.
.....
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
.....
Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
.....
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
.....
New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
New devices give customers established supply, worldwide support, design review services and fully released drivers
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries
CryptoAuthentication™ device and managed LoRa join servers enable developers to deploy secure connected applications on LoRaWAN™ networks
.....
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering
Wide operating range and on-chip EMI filtering minimizes the increasing influence of high-frequency interference
.....
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
20-inch Automotive Touchscreens Enabled by New Single-chip  
20-inch Automotive Touchscreens Enabled by New Single-chip maXTouch Touchscreen Controllers from Microchip
New controllers support thick cover lenses with multi-finger touch and address automotive functional safety requirements
.....
Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life
.....
Accelerate Development of Remote IoT Nodes with the 
INICnet Technology Simplifies Automotive Infotainment Networking  
INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
.....
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs
.....
Extend Battery Life in Portable Devices with New Ultra-low Iq LDO 
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components 
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components
Flexible solution covers a wide frequency range without requiring an external crystal
.....
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family
Measure temperature fluctuation with industry’s first rate-of-change reporting feature
.....
Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family 
Company of the week

TE Connectivity
Address Book


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


Foremost Electronics


RS Components GmbH


SECTRON


FAULHABER


Willow Technologies


ABB


Visual Communications Company, LLC


ACS Motion Control


LASER COMPONENTS


Transfer Multisort Elektronik Sp. z o.o.


Hradil Spezialkabel GmbH


Sonderhoff Holding GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


LEM


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET
Calendary
LIGHTFAIR 2019, Philadelphia, PA USA, 21.5.-23.5.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
MWC Shanghai 2019, 26.6.-28.6.2019
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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