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Power Integrations Unveils High-Efficien

New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments

New SAR ADC Family Enables High-Speed, High-Resolution  

As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments

To address applications that demand higher-speed and higher-resolution analog-to-digital conversion, Microchip Technology Inc. (Nasdaq: MCHP) today announced 12 new Successive Approximation Register (SAR) Analog-to-Digital Converters (ADCs) along with a companion differential amplifier designed specifically for the new portfolio of SAR ADCs. Designed to operate in high temperatures and high electromagnetic environments, the MCP331x1(D)-xx family includes the industry’s only one million samples per second (Msps) fully AEC-Q100-qualified 16-bit SAR, providing the reliability required for automotive and industrial applications. The MCP6D11 differential amplifier provides a low-distortion, high-accuracy interface to achieve the full performance of the ADC within systems.

The MCP331x1(D)-xx family ranges in resolution from 12-, 14- and 16-bit, with speed options ranging from 500 kilosamples per second (ksps) to 1 Msps, allowing developers to choose the right ADC for their designs. A fixed low analog supply voltage (AVDD) of 1.8V and low-current operation (1.6 mA typical active current for 1 Msps and 1.4 mA for 500 ksps) enables this family of ADCs to have an ultra-low power consumption, while maintaining a wide input full-scale range.

These devices support a wide digital I/O interface voltage (DVIO) range (1.7V - 5.5V) which allows it to interface with most host devices, including Microchip’s PIC32, AVR® and Arm®-based microcontrollers and microprocessors. This eliminates the need for using external voltage level shifters. The MCP331x1(D)-xx family contains both single-ended and differential input voltage measurement options, enabling systems to convert the difference between any two arbitrary waveforms. Ideal for applications such as high-precision data acquisition, electric vehicle battery management, motor control and switch-mode power supplies, the AEC-Q100-qualified family provides reliable performance across harsh environments.  

Properly interfacing a small analog signal to a high-speed, high-resolution ADC without introducing additional noise and distortion is a critical challenge. Microchip’s MCP6D11 differential amplifier is designed specifically to address this challenge, providing a low-distortion and high-accuracy interface to properly drive the ADC.

 “The ADC market and applications are pushing toward higher resolution, higher speed and higher accuracy,” said Bryan J. Liddiard, vice president of Microchip’s mixed-signal and linear business unit. “In addition, lower power consumption and smaller packaging are also tremendously important, and these products address all these demands.”

Development Tools

The MCP331x1D-XX Evaluation Kit is available to demonstrate the performance of the MCP331x1D-XX SAR ADC family devices. The evaluation kit includes the following:

  • MCP331x1D Evaluation Board
  • PIC32MZ EF MCU Curiosity Board for data collection
  • SAR ADC Utility PC Graphical User Interface (GUI)

Pricing and Availability

Pricing for the new SAR ADCS range from the MCP33111 available for $1.45 each in 10,000-unit quantities to the MCP33131 available for $4.65 each in 10,000-unit quantities. Each ADC is available in either the 10-MSOP with leads in a 3 mm X 3 mm package or 10-TDFN no leads 3 mm X 3 mm package. The 9 mm2 size is the smallest footprint available in the market for a 16-bit, 1 Msps differential ADC. Pricing for the MCP6D11 is $1.17 in 10,000-unit quantities and is available in the 8-MSOP or 3 mm x 3 mm 16-QFN package. The MCP331x1(D)-xx Evaluation Kit is available for $175.

For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here visit our purchasing portal or contact a Microchip authorized distributor.

2019030602 / 06.03.2019 / Electronic-components / Microchip Technology Inc. /

Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
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.....
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
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Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
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Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
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Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
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Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
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New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
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.....
New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
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New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
20-inch Automotive Touchscreens Enabled by New Single-chip  
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INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
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Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs
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Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components 
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TE Connectivity
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AVNET
Calendary
LIGHTFAIR 2019, Philadelphia, PA USA, 21.5.-23.5.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
MWC Shanghai 2019, 26.6.-28.6.2019
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
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Mouser Electronics Warehouse Tour with Grant Imahara
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