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Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges

Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges

Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.

Key Facts:

  • Enhanced TimeProvider® 4100 family adds 10 Gigabit Ethernet support
  • Supports industry’s most accurate time transfer over mobile and latest cable networks
  • Boundary Clock operation mode for lower operational costs and improved timing flow
  • Three Release 3.0 modules of Integrated GNSS Master (IGM) add new capabilities

Another challenge is keeping services operating through Global Navigation Satellite System (GNSS) lapses due to vulnerabilities such as jamming, spoofing or loss of signal. The TimeProvider release adds 10 Gigabit Ethernet (GE) support, a Boundary Clock operation mode that lowers operational costs, and other enhancements to improve how timing flows are distributed from multiple sources to a network’s base stations and other endpoints. TimeProvider 4100 2.0 with its 10 GE expansion module has been selected by SK Telecom in Korea for its world-leading delivery of 5G services in the Seoul metropolitan area and Chungcheong province.

Extending the TimeProvider 4100’s Gateway Clock operation mode with Microchip’s High-Performance Boundary Clock (HP-BC) operation mode enables it to support the latest high-accuracy ITU-T Class C & D boundary clock standards. These standards dictate extremely accurate time transfer over optical networks so operators can use Dense Wavelength Division Multiplexing (DWDM) technology rather than dedicated fibre. Release 2.0 accommodates escalating bandwidth requirements of next-generation network devices through an optional expansion module that provides 10 GE interfaces. Expanded monitoring functions enable service providers to understand how time and phase performance is affected by network elements. PTP client capacity has been increased to 790 to provide the scalability that is critical for deployments in mobile network aggregation layers and new DOCSIS 3.1 Remote-PHY cable architectures.

For service providers that need to deploy more compact PTP 1588 v2 Grandmasters to fewer base stations closer to the network’s edge, Microchip is also introducing Release 3.0 to its Integrated GNSS Master (IGM) family. IGM 3.0 combines an IEEE-1588v2 PTP Grandmaster with a GNSS receiver and antenna to simplify indoor or outdoor installations.

Each of the three IGM 3.0 additions deliver precise time and phase as well as new capabilities enabled by IGM Plus hardware models with enhanced oscillators and GNSS receivers. The new oscillator options extend time-keeping holdover performance while the enhanced receiver speeds satellite signal acquisition and improves security by accessing more GNSS constellations simultaneously. The receiver upgrade option supports GPS, Galileo (Europe), QZSS (Japan) and GLONASS, and is Beidou-ready. The IGM 3.0 software includes higher PTP capacity to 60 clients in addition to IPv6 support for traffic and management flows.

Both TimeProvider 4100 Release 2.0 and IGM Release 3.0 are managed with TimePictra®, the centralised and unified management platform for the company’s broad family of precise timing systems. Microchip’s TimeProvider 4100 2.0 and IGM 3.0 1588v2 PTP Grandmasters are available now. The TimeProvider 4100 2.0 expansion module and three IGM Plus models with enhanced features can be ordered separately. Customers with a valid annual maintenance and support agreement can load software options and upgrades for TimeProvider 4100 2.0 onto existing hardware models. The company also offers a variety of support services spanning hardware and software repair, maintenance, updates and upgrades, as well as options for adding new capabilities through hardware modules and licensed software.

For more information, visit: TimeProvider 4100 Release 2.0

2019051504 / 15.05.2019 / Various / Microchip Technology Inc. /

Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.
.....
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
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Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
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Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
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Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
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New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
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New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
New devices give customers established supply, worldwide support, design review services and fully released drivers
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PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
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CryptoAuthentication™ device and managed LoRa join servers enable developers to deploy secure connected applications on LoRaWAN™ networks
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New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering
Wide operating range and on-chip EMI filtering minimizes the increasing influence of high-frequency interference
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New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
20-inch Automotive Touchscreens Enabled by New Single-chip  
20-inch Automotive Touchscreens Enabled by New Single-chip maXTouch Touchscreen Controllers from Microchip
New controllers support thick cover lenses with multi-finger touch and address automotive functional safety requirements
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Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
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Accelerate Development of Remote IoT Nodes with the 
INICnet Technology Simplifies Automotive Infotainment Networking  
INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
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Extend Battery Life in Portable Devices with New Ultra-low Iq LDO
Device prolongs battery life up to four times longer than traditional ultra-low Iq LDOs
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Extend Battery Life in Portable Devices with New Ultra-low Iq LDO 
Industry’s Smallest Multi-output MEMS Clock Generator Offers Up to 80 Percent Board Space Savings on Timing Components 
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Flexible solution covers a wide frequency range without requiring an external crystal
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Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family
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Company of the week

TE Connectivity
Address Book


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


Foremost Electronics


RS Components GmbH


SECTRON


FAULHABER


Willow Technologies


ABB


Visual Communications Company, LLC


ACS Motion Control


LASER COMPONENTS


Transfer Multisort Elektronik Sp. z o.o.


Hradil Spezialkabel GmbH


Sonderhoff Holding GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


LEM


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET
Calendary
MWC Shanghai 2019, 26.6.-28.6.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
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The ISS Design Challenge ...
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Mouser Electronics Warehouse Tour with Grant Imahara
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