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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
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HF41F
 
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GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
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MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
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Power Integrations Unveils High-Efficien

Preserve Legacy Low Pin Count (LPC) Investments with the Industry’s First Commercial eSPI to LPC Bridge

Preserve Legacy Low Pin Count (LPC) Investments 

Device allows industrial computing developers to integrate the eSPI standard in existing equipment, minimizing development costs and extending product lifecycles

As the industrial computing industry transitions from Low Pin Count (LPC) to enhanced Serial Peripheral Interface (eSPI) bus technology, developers face high development costs to update existing equipment to the new standard. To allow developers to implement the eSPI standard while preserving large investments in legacy LPC equipment, Microchip Technology Inc. (Nasdaq: MCHP) today announced the industry’s first commercially available eSPI to LPC bridge. The ECE1200 bridge enables developers to implement the eSPI standard in boards with legacy LPC connectors and peripherals, substantially minimizing development costs and risk.

Product longevity is critical in industrial computing equipment applications because of the significant upfront investment required. The ECE1200 eSPI to LPC bridge allows developers to maintain long lifecycles while supporting the eSPI bus technology that is required for new computing applications utilizing the next generation of chipsets and CPUs. To reduce risk for developers, the eSPI bus technology went through intensive validation for industrial computing applications and has been validated with leading processor companies.

“Microchip has been at the forefront of providing eSPI since the standard’s infancy in the computing space,” said Ian Harris, vice president of Microchip’s computing products business unit. “We are continuously bringing new products to market to help the industry transition to eSPI. The ECE1200 extends our leadership in this market and allows customers to implement eSPI without sacrificing years of investments in legacy LPC equipment.”

Designed for today’s eSPI requirements, the ECE1200 detects and supports Modern Standby mode with low standby current. This helps industrial computing developers manage operating costs and efficiencies, while maintaining the features end users expect from modern devices. The ECE1200 is simple to implement and does not require any software.

Development Tools

To streamline development, the ECE1200 comes with a BIOS porting guide, schematics and a layout guide.

Pricing and Availability

The ECE1200-I/LD is available today in a 40-pin VQFN package for $2.66 each in 10,000-unit quantities.

For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here visit our purchasing portal or contact a Microchip authorized distributor.

2019060201 / 06.06.2019 / Electronic-components / Microchip Technology Inc. /

Preserve Legacy Low Pin Count (LPC) Investments 
Preserve Legacy Low Pin Count (LPC) Investments with the Industry’s First Commercial eSPI to LPC Bridge
Device allows industrial computing developers to integrate the eSPI standard in existing equipment, minimizing development costs and extending product lifecycles
.....
Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity
Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.
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Industry’s first terabit-scale Ethernet PHY
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems
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Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
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Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces production release of Silicon Carbide (SiC) 
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
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Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
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Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
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Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
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Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
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MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
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MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
New SAR ADC Family Enables High-Speed, High-Resolution  
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
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Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
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Connect PIC® MCU Applications to Google Cloud in Minutes with  
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
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Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries
CryptoAuthentication™ device and managed LoRa join servers enable developers to deploy secure connected applications on LoRaWAN™ networks
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Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering
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20-inch Automotive Touchscreens Enabled by New Single-chip maXTouch Touchscreen Controllers from Microchip
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20-inch Automotive Touchscreens Enabled by New Single-chip  
Accelerate Development of Remote IoT Nodes with the 
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INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
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INICnet Technology Simplifies Automotive Infotainment Networking  
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TE Connectivity
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HIROSE ELECTRIC CO., LTD
Calendary
MWC Shanghai 2019, 26.6.-28.6.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
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Mouser Electronics Warehouse Tour with Grant Imahara
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