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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien

Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity

Industry’s first terabit-scale Ethernet PHY

Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.

Key Facts:

  • META-DX1 combines 100 GbE, 400 GbE and FlexE with nanosecond timestamping accuracy
  • Uniquely integrates MACsec security engine in a single chip with terabit capacity
  • Enables line cards to quadruple in capacity and meet 5G timing requirements
  • Flexible crosspoint switching simplifies the transition to 100 GbE and 400 GbE optics

Integrated into a single chip, the META-DX1 family combines Ethernet ports from 1 Gigabit Ethernet (GbE) to 400 GbE, Flexible Ethernet (FlexE), Media Access Control Security (MACsec) link encryption and nanosecond timestamping accuracy at terabit capacity.

The industry is transitioning from 100 Gigabit Ethernet (GbE) to 400 GbE to support traffic within hyperscale data centres. According to Cisco’s Global Cloud Index, this traffic will quadruple by 2021 with data centre-to-data centre traffic growing at more than a 30 percent Cumulative Annual Growth Rate (CAGR). The META-DX1 enables line cards to quadruple in capacity, from 3.6 terabits per second (Tbps) to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE, while supporting key features needed by service providers.

The META-DX1 MACsec engine secures traffic leaving the data centre or enterprise premises. FlexE enables both cloud and telecom service providers to meet capacity requirements while reducing fibre-plant capital expenditures by optimally configuring links beyond today’s fixed-rate Ethernet so they can use low-cost, high-volume optics. The META-DX1 family uniquely combines MACsec and FlexE into one solution to meet the next phase of capacity scaling in Data Centre Interconnect (DCI) buildouts.

Further differentiating META-DX1, its integrated flexible crosspoint switching capability makes it easier for OEMs to navigate the market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures by enabling them to support a single design or SKU for both 100 GbE (QSFP28) and 400 GbE (QSFP-DD) optics. By providing high-performance timestamping with nanosecond-level accuracy on every port, META-DX1 also ensures network buildouts will meet the challenging timing requirements of 5G mobile base station deployments.

Initial META-DX1 family members will sample during the third calendar quarter of 2019. All are hardware-compatible and supported by the same Software Developer’s Kit (SDK).

For more information, visit: META-DX1

2019060202 / 02.06.2019 / Electronic-components / Microchip Technology Inc. /

Preserve Legacy Low Pin Count (LPC) Investments 
Preserve Legacy Low Pin Count (LPC) Investments with the Industry’s First Commercial eSPI to LPC Bridge
Device allows industrial computing developers to integrate the eSPI standard in existing equipment, minimizing development costs and extending product lifecycles
.....
Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity
Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.
.....
Industry’s first terabit-scale Ethernet PHY
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems
Microchip Technology Inc., via its Microsemi subsidiary, announces a cost-effective eight-port Power over Ethernet (PoE) switch which provides guaranteed power of 60 Watts (W) per port for all eight ports simultaneously. Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design.
.....
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.
.....
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces production release of Silicon Carbide (SiC) 
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
.....
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
.....
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications
.....
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
.....
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
.....
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
.....
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
New SAR ADC Family Enables High-Speed, High-Resolution  
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
.....
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
.....
Connect PIC® MCU Applications to Google Cloud in Minutes with  
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
New devices give customers established supply, worldwide support, design review services and fully released drivers
.....
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries
CryptoAuthentication™ device and managed LoRa join servers enable developers to deploy secure connected applications on LoRaWAN™ networks
.....
Industry’s First End-to-End LoRa® Security Solution Provides Secure Key Provisioning with Microchip and The Things Industries 
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering 
New 45V, Zero-drift Operational Amplifier Provides Ultra-high Precision Plus EMI Filtering
Wide operating range and on-chip EMI filtering minimizes the increasing influence of high-frequency interference
.....
20-inch Automotive Touchscreens Enabled by New Single-chip maXTouch Touchscreen Controllers from Microchip
New controllers support thick cover lenses with multi-finger touch and address automotive functional safety requirements
.....
20-inch Automotive Touchscreens Enabled by New Single-chip  
Accelerate Development of Remote IoT Nodes with the 
Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life
.....
INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
INICnet coexists with automotive Ethernet, efficiently linking IP-based communication across vehicle domains
.....
INICnet Technology Simplifies Automotive Infotainment Networking  
Company of the week

TE Connectivity
Address Book


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


ČEZ a.s.


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


Foremost Electronics


RS Components GmbH


SECTRON


FAULHABER


Willow Technologies


ABB


Visual Communications Company, LLC


ACS Motion Control


LASER COMPONENTS


Transfer Multisort Elektronik Sp. z o.o.


Hradil Spezialkabel GmbH


Sonderhoff Holding GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


LEM


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD
Calendary
MWC Shanghai 2019, 26.6.-28.6.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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