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Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity
Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.

Key Facts:

  • META-DX1 combines 100 GbE, 400 GbE and FlexE with nanosecond timestamping accuracy
  • Uniquely integrates MACsec security engine in a single chip with terabit capacity
  • Enables line cards to quadruple in capacity and meet 5G timing requirements
  • Flexible crosspoint switching simplifies the transition to 100 GbE and 400 GbE optics

Integrated into a single chip, the META-DX1 family combines Ethernet ports from 1 Gigabit Ethernet (GbE) to 400 GbE, Flexible Ethernet (FlexE), Media Access Control Security (MACsec) link encryption and nanosecond timestamping accuracy at terabit capacity.

The industry is transitioning from 100 Gigabit Ethernet (GbE) to 400 GbE to support traffic within hyperscale data centres. According to Cisco’s Global Cloud Index, this traffic will quadruple by 2021 with data centre-to-data centre traffic growing at more than a 30 percent Cumulative Annual Growth Rate (CAGR). The META-DX1 enables line cards to quadruple in capacity, from 3.6 terabits per second (Tbps) to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE, while supporting key features needed by service providers.

The META-DX1 MACsec engine secures traffic leaving the data centre or enterprise premises. FlexE enables both cloud and telecom service providers to meet capacity requirements while reducing fibre-plant capital expenditures by optimally configuring links beyond today’s fixed-rate Ethernet so they can use low-cost, high-volume optics. The META-DX1 family uniquely combines MACsec and FlexE into one solution to meet the next phase of capacity scaling in Data Centre Interconnect (DCI) buildouts.

Further differentiating META-DX1, its integrated flexible crosspoint switching capability makes it easier for OEMs to navigate the market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures by enabling them to support a single design or SKU for both 100 GbE (QSFP28) and 400 GbE (QSFP-DD) optics. By providing high-performance timestamping with nanosecond-level accuracy on every port, META-DX1 also ensures network buildouts will meet the challenging timing requirements of 5G mobile base station deployments.

Initial META-DX1 family members will sample during the third calendar quarter of 2019. All are hardware-compatible and supported by the same Software Developer’s Kit (SDK).

For more information, visit: META-DX1

2019060202 / 02.06.2019 / Electronic-components / Microchip Technology Inc. /

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
Added voltage level shifting capabilities help increase flexibility and reduce system costs

To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC
Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements

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