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TDK announces world’s first MIPI standard SoundWire® microphone

TDK announces world’s first MIPI standard SoundWire® microphone

TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

  • T5808 is a 66 dB SNR/135dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package
  • Supports up to seven individually configurable microphones on a single audio bus
  • SoundWire 1.1 compliant based on Mobile Industry Processor Interface (MIPI) Alliance open standards

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM).  The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can seamlessly transition back and forth without audio glitches.

The SoundWire Standards Committee, who created the MIPI standard for SoundWire, includes technology leaders in application processors, audio DSPs and codecs, and other ICs. SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire revolutionizes how audio devices and ICs communicate by integrating audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.

“As a member of the SoundWire Standards Committee, Qualcomm Technologies has supported the SoundWire interface on speaker amplifier producs for a number of years. We are excited to see TDK’s microphone technology now incorporating this interface,” says Rahul Shinkre, Director, Product Management at Qualcomm Technologies, Inc.

TDK will be demonstrating the T5808 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5808 is currently in mass production and will be available through distribution in Q1 2020.  For samples and additional information, please contact sales@invensense.com or visit www.invensense.tdk.com/products/digital/t5808/


Glossary

  • HQM: High Quality Mode
  • LPM: Low Power Mode
  • CCM: Concurrent Mode
  • AOP: Acoustic Overload Point

Main applications

  • Smartphones
  • Microphone Arrays
  • Tablets
  • Cameras
  • Bluetooth Headsets
  • Notebook PCs
  • Security and Surveillance

Key features

  • 5 × 2.65 × 0.98 mm surface‐mount package
  • Low power: 215 µA in Low‐Power Mode
  • Extended frequency response from 40 Hz to >20 kHz
  • Sleep Mode: 10 µA
  • High power supply rejection (PSR): −91 dB FS
  • Fourth‐order Σ‐Δ modulator
  • Digital pulse density modulation (PDM) output
  • Compatible with Sn/Pb and Pb‐free solder processes
  • RoHS/WEEE compliant

 

Key data

Product T5808
Packaging Dimensions (mm) 3.50 × 2.65 × 0.98
SNR dBA 66
Acoutsic Overload Point dB SPL 135
Low Power Mode µA 215
Bandwidth kHz 20
Low Frequency Corner Hz 40
Digital Interface SoundWire

2020011204 / 15.01.2020 / Electronic-components / TDK Corporation /

TDK announces world’s first MIPI standard SoundWire® microphone
TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.
.....
Inertial sensors: Miniaturized MEMS accelerometer with excellent linearity
TDK Corporation announces the Tronics AXO215 high-performance MEMS accelerometer that sets the benchmark in terms of miniaturization, reliability and inertial sensing performance in harsh environments. Developed by Tronics Microsystems, a TDK Group Company that designs and manufactures innovative nano and microsystems, the new closed-loop accelerometer complements the lineup of TRONICS GYPRO® sensors.
.....
Inertial sensors: Miniaturized MEMS accelerometer with excellent linearity
Inductors: Low loss thin-film metal inductors with high current capability for power supply circuits
Inductors: Low loss thin-film metal inductors with high current capability for power supply circuits
TDK Corporation presents the new TFM160808ALC thin-film inductor for power supply circuits, which features a maximum DC resistance of 62 mΩ that is 30 percent lower than for existing types (e.g. TFM160808ALM, 0.47 μH). The new type, whose compact dimensions are just 1.6 mm x 0.8 mm x 0.8 mm, also offers a high rated current of 2.6 A and an inductance of 0.47 μH.
.....
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Nicomatic


TE Connectivity


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LASER COMPONENTS
Calendary
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
APEX EXPO 2020, San Diego, 4.2.-6.2.2020
embedded world 2020, Nuremberg, 25.2.-27.2.2020
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
Light + Building 2020, Frankfurt am Main, 8.3.-13.3.2020
AMPER 2020, Brno, CZ, 17.3.-20.3.2020
SECUTECH 2020, Taipei, 22.4.-24.4.2020
SMTconnect 2020, Nuremberg, 5.5.-7.5.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
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Wire & Cable Guangzhou, China, 27.5.-29.5.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
Automechanika Dubai, 7.6.-9.7.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
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