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AMD Ryzen™ based congatec COM Express module for the industrial temperature range

AMD Ryzen™ based congatec COM Express module for the industrial temperature range

congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.

The most demanding graphics and compute workloads benefit from the modules’ 4 cores, 8 threads and 8 GPU compute units delivering the well-reputed massive processing throughput of AMD’s Zen microarchitecture in an ultra-rugged shape. The TDP is scalable from 12W to 25W enabling truly immersive 4k UHD system designs with passive cooling only. Typical applications for the new industrial-grade COM Express modules can be found in rugged edge computing with embedded vision and artificial intelligence (AI), autonomous vehicles, railcars and wagons, outdoor equipment in the oil and gas industries, mobile ambulance equipment, broadcasting vans, or in security and video surveillance, as well as base station equipment for 5G, to name just a few.

The maximum performance of the new conga-TR4 COM Express Type 6 module depends on the environmental conditions and is specified with 1.6 GHz to 2.8 GHz turbo boost in the sub-zero temperature range, and 2.0 GHz to a maximum of 3.6 GHz in the positive temperature range. The impressive performance of the ultra-rugged conga-TR4 Computer-on-Modules has been made available in a real-time capable design and also includes real-time hypervisor support by Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. 

The feature set in detail

The new conga-TR4 high-performance module with COM Express Type 6 pinout is based on the latest AMD Ryzen™ Embedded V1404I multi-core processor for the industrial temperature range. It supports up to 32GB energy-efficient and fast dual-channel DDR4 memory with up to 2400 MT/s and optional ECC for maximum data security. The integrated AMD Radeon™ Vega graphics with 8 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video in both directions. Thanks to HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. In safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated RSA, SHA, and AES encryption and decryption. 

The new conga-TR4 allows a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces include 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, and 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces. The supported operating systems include Linux, Yocto 2.0 and Microsoft Windows 10, or optionally Windows 7.  

The conga-TR4 COM Express Type 6 Computer-on-Modules can be ordered in the following variants, with standard temperature range configurations also available: 

Processor Cores/Threads Clock [GHz] (Base/Boost)  L2/L3 Cache (MB)  GPU Compute Units TDP [W] 
New: AMD Ryzen
Embedded V1404I
4 / 4 2.0 /3.6 
(<0°C: 1.6/2.8)
2 / 4 8 12 - 25
AMD Ryzen
Embedded V1807B
4 / 8 3.35 / 3.75 2 / 4 11 35 - 54
AMD Ryzen
Embedded V1756B
4 / 8 3.25 / 3.60 2 / 4 8 35 - 54
AMD Ryzen
Embedded V1605B
4 / 8 2.0 / 3.6 2 / 4 8 12 - 25
AMD Ryzen
Embedded V1202B
2 / 4 2.5 / 3.4 1 / 2 3 12 - 25

More information about the new conga-TR4 high-performance COM Express Type 6 module is available at: https://www.congatec.com/en/products/com-express-type6/conga-tr4.html 

2020051501 / 15.05.2020 / Embedded / congatec AG /

AMD Ryzen™ based congatec COM Express module for the industrial temperature range
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
.....
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
.....
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-on-Modules (COM) Advantages when compared to a full custom design.
.....
congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers
.....
congatec launches 100 Watt ecosystem for embedded edge and micro servers
New congatec SMARC module with NXP i.MX 8M Mini processor
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
.....
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
.....
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec doubles RAM support for Server-on-Modules
congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
.....
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
.....
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
.....
congatec welcomes official release of the COM Express 3.0 specification
congatec’s Type 7 Server-on-Modules are now PICMG standard
.....
congatec welcomes official release of the COM Express 3.0 specification
congatec’s new COM Express Mini module with Intel Apollo Lake processors
congatec’s new COM Express Mini module with Intel Apollo Lake processors
Offers more than any credit card sized COM Express module before
.....
congatec’s new COM Express modules with latest Intel® Celeron® processors, codenamed Skylake
congatec integrates today’s most cost efficient Intel® Celeron® processor with fast DDR4 SO-DIMM memory support
.....
congatec’s new COM Express modules with latest Intel® Celeron® processors, codenamed Skylake
New congatec Server-on-Modules for real-time media processing 
New congatec Server-on-Modules for real-time media processing
congatec introduces new Server-on-Modules with high transcoding performance based on the latest Intel® Xeon® processors
.....
congatec presents first µQseven computer modules
congatec accelerates ongoing miniaturization trend by offering µQseven modules with Freescale i.MX 6 processors
.....
congatec presents first µQseven computer modules
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Calendary
CWIEME Berlin, 26.5.-28.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
PCIM Europe, Nuremberg, 28.7.-30.7.2020
SMTconnect 2020, Nuremberg, 28.7.-30.7..2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
NEPCON Nagoya, Japan, 21.10.-23.10.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
NEPCON Japan, Tokio, 20.1.-22.1.2021
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
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DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
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