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congatec to solve ruggedization challenges of edge server and client designs

congatec to solve ruggedization challenges of edge server and client designs

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

Deggendorf, Germany, 18 February 2021 * * * congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The solution portfolio for COM-HPC server modules is particularly impressive, tackling the fact that a significantly higher TDP must be mastered for these edge computing platforms, which represents a challenging task especially in the extended temperature range. 

The driving force behind this focus is the increasing demand for rugged edge and real-time fog computing technologies to facilitate digitization projects in often extremely
harsh and challenging environments. Typical use cases for these ultra-durable platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networks, piping systems for the oil, gas and freshwater industries, telecom and broadcasting networks, as well as distributed surveillance and security systems. Further target markets include network connected industrial and medical devices with IIoT / Industry 4.0 connectivity, outdoor kiosk and digital signage systems and, not to forget, in-vehicle applications such as autonomous logistic vehicles. 

The new platforms for harsh environments presented by congatec support extreme temperature ranges from -40°C to +85°C, feature BGA soldered processors for shock and vibration as well as high EMI resistance, and can optionally be made available with conformal coating to protect the platforms against ingress from condensation, salt water and dust.

New COM-HPC and COM Express with scalable 11th Gen Intel® Core™ processors

A highlight of the presentations are the high-end x86 Computer-on-Modules for extreme environments based on the COM-HPC and COM Express standards. The conga-HPC/cTLU COM-HPC Client Size A modules as well as the conga-TC570 COM Express Compact modules are available with new scalable 11th Gen Intel® Core™ processors for extreme temperatures ranging from -40°C to +85°C. Both modules are the first to support PCIe x4 in Gen 4 performance to connect peripherals with massive bandwidth.

Platforms with Intel Atom® x6000E Series processors

congatec’s rugged platforms with extended temperature options from -40°C to +85°C on the basis of Intel Atom® x6000E Series, Intel® Celeron® and Pentium® N & J Series processors are available as Computer-on-Modules in the SMARC, Qseven, COM Express Compact and Mini form factors, and also as Pico-ITX Single Board Computers (SBCs). They impress especially in real-time industrial markets, offering not only improved performance but also Time Sensitive Networking (TSN), Intel® Time Coordinated Computing (Intel® TCC), hypervisor support from Real Time Systems (RTS), and BIOS configurable ECC.

New SMARC 2.1 Computer-on-Module with i.MX 8M Plus processor

The presentation is complemented by the exhibition of the brand new SMARC 2.1 Computer-on-Module with i.MX 8M Plus processor. Consuming only 2 - 6 watts, this ultra low power embedded and edge computing platform for extended temperature ranges convinces with 4 powerful Arm Cortex-A53 processor cores and an additional Neural Processing Unit (NPU), which adds up to 2.3 TOPS of AI computing power. Specifically designed for AI inferencing and machine learning at the edge, the modules are also optimized for processing and analyzing dual-camera Image Signal Processor (ISP) data received via the 2 integrated MIPI-CSI interfaces.

Extensive value package for all the extended temperature range platforms included

The platforms provide all features and services required for reliable operation in the most challenging environments. The value package includes rugged passive cooling options, optional conformal coating for protection against corrosion caused by moisture or condensation, a list of recommended carrier board schematics, and components that are specifically designed for the extended temperature range for highest reliability. This impressive technical feature set is complemented by a comprehensive service offering that includes temperature screening, high speed signal compliance testing along with design-in services and all training sessions required to simplify the use of congatec’s embedded computer technologies.

For more information about congatec’s extended temperature range offerings for rugged edge and real-time fog computing please visit our congatec booth at virtual embedded world 2021 here: https://www.congatec.com/en/congatec/events/embedded-world/

2021021902 / 19.02.2021 / Electronic-components / congatec AG /

congatec to solve ruggedization challenges of edge server and client designs
congatec to solve ruggedization challenges of edge server and client designs
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC
.....
ANYbotics’ ANYmal C robot is a multi-module machine
Rugged four-legged robot with three brains
.....
ANYbotics’ ANYmal C robot is a multi-module machine
First COM-HPC and next-gen COM Express
First COM-HPC and next-gen COM Express
congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options
.....
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
More performance and less dollars per watt
.....
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand
.....
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
.....
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
.....
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-on-Modules (COM) Advantages when compared to a full custom design.
.....
Computer-On-Modules are world-leading platforms for embedded system designs
congatec launches 100 Watt ecosystem for embedded edge and micro servers
congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
.....
congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
.....
congatec doubles RAM support for Server-on-Modules
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec welcomes official release of the COM Express 3.0 specification
congatec welcomes official release of the COM Express 3.0 specification
congatec’s Type 7 Server-on-Modules are now PICMG standard
.....
congatec’s new COM Express Mini module with Intel Apollo Lake processors
Offers more than any credit card sized COM Express module before
.....
congatec’s new COM Express Mini module with Intel Apollo Lake processors
congatec’s new COM Express modules with latest Intel® Celeron® processors, codenamed Skylake
congatec’s new COM Express modules with latest Intel® Celeron® processors, codenamed Skylake
congatec integrates today’s most cost efficient Intel® Celeron® processor with fast DDR4 SO-DIMM memory support
.....
New congatec Server-on-Modules for real-time media processing
congatec introduces new Server-on-Modules with high transcoding performance based on the latest Intel® Xeon® processors
.....
New congatec Server-on-Modules for real-time media processing 
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