Go to HomePage ELECTRONIC-INFO.EU
electronic-info.eu - Audio-video-hifi - New eBook development platform ...
electronic-info.eu - Texas Instruments - New eBook development platform ...

New eBook development platform based on TI’s OMAP™ 3 technology speeds time to market, lowers costs for eBook manufacturers

New eBook development platform based on TI’s OMAP™ 3 technology speeds time to market, lowers costs for eBook manufacturers 

With 2009 recognized as a watershed year in the evolution of the eBook market, manufacturers and developers are racing to meet consumer demands in this emerging segment. Answering the call for differentiated devices, Texas Instruments Incorporated (TI) (NYSE: TXN) unveiled an OMAP™ 3 processor-based eBook development platform to help manufacturers and developers rapidly deploy their endless ideas to launch new, innovative eBook readers into consumers’ hands.


Touting a sleek electrophoretic display, TI’s comprehensive platform includes the new OMAP3621 applications processor, WiLink™ 6.0 WiFi/Bluetooth®/FM “combo” connectivity solution, the new TPS6518x electronic paper display (EPD) power management IC, along with other TI analog solutions, and 3G modem connectivity support.

Driving new eBook experiences with TI’s OMAP processor technology
The eBook development platform leverages TI’s proven high-performance, low-power, 45nm OMAP 3 processor family which provides a robust, multitasking environment to simultaneously support applications which exercise the CPU, multimedia and graphics engines. The OMAP3621 processor will allow users to read their favorite eBook on an electrophoretic display, while simultaneously scanning the web on a second display for their next purchase. The processor boasts a high performance ARM® Cortex™-A8 CPU integrated with Imagination POWERVR3D graphics acceleration, and TI’s proven C64x+DSP technology for multimedia acceleration. The OMAP3621 processor delivers an optimized peripheral set in a 12mmx12mm, 0.5mm ball pitch package with low power DDR memory support. The solution’s smaller footprint enables sleek consumer designs while also delivering power and performance metrics that will change how consumers use eBooks in the future. The processor also provides added flexibility with its programmable architecture design. Leveraging the programmability of the OMAP platform enables customers to further differentiate their devices and stand out in the marketplace, giving their devices a unique look and feel.

Unique software-based display controller reduces footprint and cost
TI has employed a DSP-based software display controller, which drives E Ink’s Vizplex® electrophoretic display on the eBook development platform to further streamline eBook product development. By implementing the display controller on the DSP, the Cortex-A8 can be used to its full potential, delivering an outstanding user experience. This software controller approach reduces the total silicon footprint by more than 200mm2 as well as provides savings on overall hardware cost. TI’s overall system solution eliminates the need for:
• Typical hardware EPD controller;
• Dedicated external flash memory to store waveforms;
• Dedicated SDRAM memory for the frame buffer; and
• External temperature sensor by embedding it into TI’s TPS6518x display power management IC

Optimized power management extends usability of eBook platform
TI’s highly-optimized solutions are designed to fully address the needs of power-sensitive consumer device markets – from eBooks to smartphones – where battery life is just as critical as high performance. For example, TI’s eBook development platform will allow more than 14,800 page turns on a six-inch E Ink screen using a slim 600mAh battery, representing a 50 percent improvement over similar solutions in the market today. With this in mind, consumers could read a 500-page book approximately 20 times on a single battery charge. Additionally, TI has optimized its connectivity solutions to run in a power conscious environment. The WiLink 6.0 solution uses an innovative low-power scanning architecture that continuously scans for available WLAN access points without impacting battery life. TI’s system-level power optimization also extends idle times, allowing an eBook device to last nearly four weeks without needing to recharge.

“We are excited about the potential of the eBook market and how TI’s technologies simplifies eBook product design and enhance the overall user experience,” said Elie Belmand, general manager of TI’s mobile consumer business. “Today, we are working with more than ten leading eBook OEM and ODMs to bring compelling, new eBook devices to store shelves in 2010. Our eBook platform provides a comprehensive and solid foundation to allow these manufacturers to shorten their product development cycle times while delivering innovative devices that will ‘wow’ consumers and help propel the eBook market forward.”

See www.ti.com/ebookplatformpr  for more details .

201002220222.2.2010Audio-video-hifiTexas Instruments




qrcode
Last articles from this author/producer: Texas Instruments
31.8.2011ComponentsTexas Instruments2011072507

TI adds 20-percent run-time to ultra-low power wireless applications with 3-MHz, 100-mA step-down DC/DC converter

Texas Instruments introduced a 3-MHz, 100-mA synchronous step-down DC/DC converter, which integrates a bypass switch and a unique DCS-Control technology. The new device extends battery run-time by 20 percent in low-power wireless and MSP430™ MCU-based applications, when compared to competing solutions.

more

27.8.2011ComponentsTexas Instruments2011072506

TI bolsters ultra-low-power, high-speed, ADC family with eight dual-channel devices from 65 to 250 MSPS

Texas Instruments expanded its line of high-speed, ultra-low power consumption analog-to-digital converters (ADCs) with eight dual-channel devices available in 12- and 14-bit resolutions at speeds from 65 to 250 MSPS.

more

24.8.2011ComponentsTexas Instruments2011072505

DRV8662 - most highly integrated piezo haptic driver

/ contains 2x video / TI introduced the most highly integrated piezo haptic driver for mobile consumer and industrial designs. The DRV8662 features an integrated 105-V boost converter, power diode, and 50-V to 200-V peak-to-peak (Vpp) fully-differential amplifier, resulting in a solution size that is 50 percent smaller than leading competitors.

more

20.8.2011Industry automationTexas Instruments2011072504

TI isolated amplifier, modulator enable high-precision current measurement in motor control, green energy applications

Texas Instruments introduced an isolated amplifier and a delta-sigma modulator that enable best-in-class shunt-based current measurement in motor control and green energy applications. The AMC1200 isolated amplifier and AMC1204 delta-sigma modulator allow designers to increase accuracy, temperature stability and immunity to magnetic fields in equipment such as AC drives, solar inverters and uninterruptible power supplies.

more

17.8.2011TelecommunicationTexas Instruments2011072503

TI's new development kit helps engineers quickly and easily design Bluetooth®

/ contains 1x video / Kit merges Stellaris ARM® Cortex™-M3 MCU performance with TI’s seventh-generation CC2560 Bluetooth solution to enable streaming audio, data transfers and other advanced capabilities

more

13.8.2011ComponentsTexas Instruments2011072502

TI introduces industry's first single-chip battery management device for

/ contains 1x video / Texas Instruments introduced the industry's first fully integrated battery protection and cell-balancing solution for Li-Ion and lithium iron phosphate battery packs. The bq77910 battery management and protection device can manage 4- to 10-cell battery packs, and two devices can be stacked to protect 11- to 20-cell packs.

more

10.8.2011Test & measurementTexas Instruments2011062402

TI high-temperature H.E.A.T. evaluation module speeds safe testing of electronics for harsh and hot environments

Texas Instruments introduced the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM), the industry's first high-temperature data acquisition system, which includes a complete set of TI signal chain components qualified for extreme temperature operation from -55°C to 210°C.

more

6.8.2011TelecommunicationTexas Instruments2011071211

TI unveils low-cost Sub-1 GHz RF Value Line product family

Texas Instruments introduced a new Sub-1 GHz RF Value Line family, offering developers low-cost connectivity solutions for sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems.

more

3.8.2011ComponentsTexas Instruments2011070604

TI re-architects embedded control to make the world greener with new Concerto™ dual-core microcontrollers

TI's new Concerto 32-bit microcontrollers based on C28x and ARM® Cortex™-M3 cores enable real-time control with a 13X performance increase and advanced connectivity without compromise.

more

Last articles from this section: Audio-video-hifi
12.3.2012Audio-video-hifiSOS electronic s.r.o.2012022447

Industrial loudspeakers Visaton FR resist even to seawater!

From loudspeakers intended for industrial use, we naturally expect stable parameters even in more demanding conditions with variable temperature and humidity. FR series loudspeakers from German company Visaton meet stringent criteria, and in a WP version, they are resistant even to seawater.

more

23.7.2011Audio-video-hifiTexas Instruments2011070609

PurePath™ Wireless CC8530 device drives multichannel audio streaming on up to four channels, new headset reference design achieves 100 percent battery life ...

/ contains 1x video / Texas Instruments introduced the second device in the family of PurePath™ Wireless audio products for consumer, portable and high-end audio applications. The 2.4 GHz CC8530 radio frequency (RF) system-on-chip transmits uncompressed wireless audio over a robust RF link, and supports digital streaming for up to four audio channels.

more

30.3.2011Audio-video-hifiTexas Instruments2011031104

Newest video processors from TI transform the video experience with 3x greater HD video processing performance

Texas Instruments Incorporated expands its DaVinci™ digital media processor platform by introducing its high-performance TMS320DM8168 DaVinci digital media processor and the software compatible, power-efficient TMS320DM8148 DaVinci digital media processor.

more

16.3.2011Audio-video-hifiAXIOMTEK2011022601

Axiomtek's First IP4X-rated Standalone Fanless Digital Signage Player, DSB-300

Axiomtek releases its first stand alone robust IP4X dust-proof digital signage player that is specifically designed for digital signage applications. The DSB-300 features IP4X-rated enclosure, hardware decoder, 1920 x 1080 resolution, and an Intel® Atom™ processor D525 1.8 GHz with 4GB DDR3 system memory. This standalone box is a reliable solution when looking for a system that can withstand repeated usage and be exposed to severe operating conditions.

more

5.3.2011Audio-video-hifiMAXIM2011022614

Maxim Extends TacTouch™ Family with 4- and 10-Finger Multitouch Capacitive Touch-Screen ICs

At Mobile World Congress 2011, Maxim Integrated Products (NASDAQ: MXIM) was demonstrating the MAX11855 and MAX11871, projected capacitive touch-screen controllers offering 4-point and 10-point touch detection with industry-leading sensitivity and noise immunity performance. Building on the Company's reputation for differentiated analog and mixed-signal performance, Maxim's TacTouch family of capacitive touch-screen controllers addresses the various performance and price points demanded by OEMs. The latest TacTouch products offer superior sensitivity and noise immunity, making them the only devices capable of touch detection from a ballpoint/stylus and gloved hands.

more

25.2.2011Audio-video-hifiTexas Instruments2011022411

TI’s OMAP™ platform spurs Me-D™ experiences: Welcome to the next mobile dimension

Texas Instruments Incorporated unleashed new dimensions of the mobile world, labeled “Me-D™ experiences,” which are uniquely enabled by TI’s OMAP™ platform. What exactly are Me-D experiences? They are TI’s trend-setting interactions in which consumers are no longer limited to the physical confines of a mobile device, but rather set free by the ability to make any physical environment the center of the mobile universe.

more

27.1.2011Audio-video-hifiTexas Instruments2011010905

Texas Instruments simplifies connected audio product development with the DA8x Aureus™ nSDK, enabling up to nine months of development time savings

DALLAS (Jan. 5, 2011) — Helping audio consumer electronics (CE) manufacturers stay ahead of the latest trends in connected entertainment, Texas Instruments Incorporated is launching the networked audio software development kit (nSDK), allowing developers to quickly and easily integrate Internet radio and online streaming services into end products based on the DA8x Aureus™ platform of audio processors.

more

25.1.2011Audio-video-hifiRENESAS2011011601

Renesas Electronics Introduces New SoC that Enables Industry-Leading 16-Megapixel Still Image and High-Speed Continuous Shooting for Mobile Phones

Dusseldorf, 13th January 2011 – Renesas Electronics today announced the availability of a new system-on-chip (SoC), the CE150, for smartphones and high-end mobile phones. The CE150 delivers industry-leading resolution of 16 megapixels and the ability to capture full-HD video (1920 × 1080 pixels).

more

10.1.2011Audio-video-hifiTexas Instruments2011010901

TI’s OMAP4440 processor boasts new upgrades, raises the bar for mobile design

DALLAS (Dec. 8, 2010) – Texas Instruments Incorporated announced that the OMAP4440 applications processor enhancements deliver impressive performance improvements beyond the OMAP4430 processor, including a 1.25x increase in graphics performance, a 30 percent decrease in webpage load time, a 2x increase in 1080p video playback performance and clock speeds as fast as 1.5 GHz per ARM® Cortex™-A9 MPCore™.

more

SENSOR+TEST 2012 ...
22.-24.5.2012  -  Nuremberg, DE
AUTOMATICA 2012 ...
22.-25.5.2012  -  Munich, DE
"ECOLOGY IN ELECTRONICS", WARSAW 2012 ...
28-29.05.2012  -  Warszawa, PL
PRAGOALARM / PRAGOSEC 2012 ...
5.-7.6.2012  -  Praha, CZ
Intersolar Europe 2012 ...
13.-15.6.2012  -  Munich, DE
ELEKTRO 2012 - Moscow ...
13-16 June 2012  -  Moscow, RU
IFA 2012 ...
31.8.-5.9.2012  -  Berlin, DE
International Engineering Fair (MSV) ...
10.-14.9.2012  -  Brno, CZ
FOR ELEKTRO 2012 ...
18.-22.9.2012  -  Praha, CZ
ELO SYS 2012 ...
9.10. - 12.10.2012  -  Trenčín, SK
 
All trademarks are the property of their respective owners. ISSN 1801-3813 , Kontakt: FANDA elektronik s.r.o, Těrlická 475/22, 735 35 Horní Suchá, tel. 00420-603531605, info@elektronika.cz
12:23:01.137 / 12:23:01.380 /