Specialised packaging and handling procedures for moisture sensitive devices save time and cost
/ contains 1x video / Farnell, the leading multi-channel distributor of electronic and industrial components, now offers specialised packaging and handling procedures for products that are sensitive to moisture. The announcement benefits customers using the affected products as the new processes remove the costly and time consuming need to ‘bake’ components before use.
Initially the procedures will apply to approximately 2,500 parts with a
further 4,500 other relevant devices being phased-in over the coming months. The
packaging used by Farnell
can be resealed allowing continued safe storage if not all the components
contained are immediately required.
Moisture Sensitivity Level (MSL) provides a standard for the time period in
which a moisture sensitive device can be exposed to ambient room conditions
before sufficient moisture has been absorbed to create a situation where damage
to the product could occur. The expansion of trapped moisture can result in
separation of the plastic from the die or lead-frame, wire bond damage, die
damage, and internal cracks during flow or wave soldering production techniques.
“The implementation of MSL packaging and procedures provides real benefit
to our customers,” said Justin Willoughby, Head of Service,
Farnell Europe.
“The reassurance of knowing that the moisture sensitive devices they receive
from Farnell have been suitably handled and protected, along with the time and
cost savings achieved by not having to bake parts is significant.”
201104180230.4.2011Industry automationFARNELL