Address Book
 

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Seica
 

PEI-Genesis
 

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CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
Digi-Key Electronics


TPA3221 Class-D Amplifier
Texas Instruments' TPA3221 is a 100 W stereo and 200 W mono HD analog-input Class-D amplifier
PA.26A SMT Antenna
Taoglas' PA.26A surface mount LTE 4G antenna provides the highest efficiency in a small SMT form factor, coming in at 35 mm x 5 mm x 6 mm. Due to its rectangular shape and compact size, the PA.26A is very easy to integrate and can be mounted directly on the edge of the PCB. The PA.26A operates at all common 4G/3G/2G LTE bands.
RX130 32-Bit Microcontrollers
The 32-bit MCU RX130 microcontrollers (MCUs) from Renesas Corporation integrate a built-in maximum 36-channel capacitive touch sensor. The current RX130 MCU portfolio has up to 128 KB on-chip Flash and 80 pins. By adding this expanding lineup with 512 KB Flash and 100-pin IC packages, customers can enhance their functionality for application and system controls.
SiT3373 Differential Voltage Controlled Oscillators
SiTime's SiT3373 series of vibration resistant, 220 MHz to 700 MHz VCXOs for harsh environments
LT3045 20 V 500 mA Ultra-Low Noise LDO Regulator
Linear Technology PMIC for noise sensitive power supplies found in instrumentation, test, and medical applications
CMF Series Common Mode Chokes
Designed to suppress noise from switch mode power supplies and other sources, the versatile CMF series common mode chokes from Triad Magnetics feature superior performance, reliability, and economy in an innovative dual function open-frame design that fits easily into a wide variety of devices and systems.
GSP500/GSP750 Series AC/DC Power Supplies
XP Power’s GSP500 and GSP750 series of highly efficient AC/DC power supplies provide solutions for 500 W and 750 W applications seeking an ultra-compact footprint and a low 1U height profile. These single output, forced air cooled units can operate across a wide temperature range of -40°C to +70°C with full power available up to +50°C.
TGW-Q14BB-FCQ 100 Gigabit Optical Transceiver
Formerica’s TGW-Q14BB-FCQ is a 4-lane aggregated 100 Gbps optical pluggable transceiver designed for optical communication applications compliant with IEEE 802.3ba 100GBase-LR4 and QSFP28 MSA. The TGW-Q14BB-FCQ supports long reach of 10 km on single mode fiber.
Sigfox SDR Dongle Developers’ Platform Available Globally from Digi-Key
The Sigfox SDR dongle, designed for device and solution makers to speed up development and tests, is now available globally through Digi-Key Electronics, a global electronic components distributor. The SDR dongle allows for development of Sigfox devices independent from Sigfox public network coverage.
JVA Series Renewable Energy DC/DC Converters
XP Power’s JVA15 and JVA40 series of DC/DC converters are for renewable energy and industrial applications that require fully encapsulated DC/DC converters. They are available in either PCB or DIN rail mount versions. All models accept the ultrawide input range from 200 VDC to 1500 VDC that is common in a number of renewable and industrial applications.
ADIS16470/ADIS16475/ADIS16477 Mini Mems IMU ±2000°/sec
ADI’s ADIS16470, ADIS16475, and ADIS16477 are complete inertial measurement unit (IMU) systems that includes a triaxis gyroscope and a triaxis accelerometer. Each inertial sensor combines industry leading iMEMS® technology with signal conditioning that optimizes dynamic performance.
ChipConnect™ Cable Assemblies
TE Connectivity AMP's ChipConnect internal faceplate-to-processor cable assemblies are required for Intel® Omni-Path Architecture (OPA). In the CPU processor, these cable assemblies mate directly with LGA 3647 sockets at the processor and Intel internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds.


Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


Calendary
HKTDC Hong Kong Electronics Fair, 13.10.-16.10.2024
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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