Address Book
 

AERS
 

Flex Power Modules
 

Danisense
 

BINDER
 

Parker Hannifin
 

DANFOSS
 

MOXA
 

Alliance Memory
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA

24.03.2023 0:07:36
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r
HOME PAGE


KEMET CHOKES FROM THE SCF-XV SERIES
Chokes from the SCF-XV series by KEMET are a new part of the TME offer. These are common mode components designed for a wide range of applications in harsh environmental conditions, for example in manufacturing or in the automotive industry.
Six New 4Gb “A” Die DDR4 SDRAMs and a 16Gb Option From Micron Technology
Alliance Memory announces that it has expanded its portfolio of CMOS DDR4 SDRAMs with new “A” die versions of the 4Gb AS4C256M16D4 and AS4C512M8D4 in the 96-ball and 78-ball FBGA packages, respectively.
ATX mainboard with fast expansion slots
The IMBA-Q471 completes the portfolio of ATX mainboards from ICP Germany. In addition to the well-known IMBA-Q470, the new IMBA-Q471 is a variant that is exclusively equipped with PCI Express slots of the third generation. The third generation offers transfer rates of nearly 16GByte per second. This makes the interface almost twice as fast as its predecessor version.
Power Integrations Launches PowerPros Live Video Application-Engineering Support
Solve design challenges in real-time, 24 hours a day, six days a week
Rutronik expands logistics, field application engineering and technical support in China
Rutronik Elektronische Bauelemente GmbH is further expanding its presence in China with a new warehouse facility in Shanghai and a new office in Xiamen. This is part of Rutronik's regionalization steps to expand its global presence, such as in Asia and the USA, among others. The overall aim is to supply and advise the strategically relevant markets of the electronics industry as conveniently and directly as possible.
Renesas Unveils New-Generation Si IGBTs for Electric Vehicle Inverters
New Power Product to Be Manufactured at Renesas’ Newly Established 300mm Kofu Factory
Custom and Special Purpose connectors available from Intelliconnect on fast lead-times
Fast turnaround bespoke connectivity solutions and special purpose products
LED drivers with Bluetooth interface
Control your lighting with the new series of Mean Well drivers.
Power Integrations Delivers AEC-Qualified Buck Switcher IC with 850 mA Output for Low-Part-Count Automotive PSUs
LinkSwitch-TN2Q supports 30-550 VDC input with integrated system-level protection
KIOXIA introduces new levels of performance with Enterprise NVMe SSD family featuring PCIe 5.0 technology
CM7 series SSDs available in new EDSFF E3.S and industry standard 2.5-inch form factors
Antenova adds Agosti corner-placement antenna created for scaled-down GNSS designs
Antenova Ltd is adding a new offering to its range of miniature Surface Mount Designed (SMD) antennas and modules for GNSS applications. The new antenna, Agosti, part number SR4G080, measures 9.0 x 5.8 x 1.7 mm and operates with exceptional efficiency in a reduced space on a corner of a PCB.
New offer of professional solders by STANNOL
Safe and lead-free soldering materials available in the TME catalogue.
sps - smart production solutions, 08.–10.11.2022, Nuremberg, DE
With its unique concept, the SPS covers the entire spectrum of smart and digital automation – from simple sensors to intelligent solutions, from what is feasible today to the vision of a fully digitalized industrial world.
Microchip Expands Its Portfolio of MPU-Based System-on-Modules (SOMs) with the SAM9X60D1G-SOM
The latest small-form factor SOM eases design and manufacturing and speeds time to market.
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
The MSV International Engineering Fair is the most important industrial fair in Central Europe. The majority of visitors are professionals. Nearly 80% of those in attendance exert influence on business investment, and one third form part of the top management of their firms.
congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs
Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power
congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change
Company of the week

AERS

Interesting video


Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


PICMG

Laird Thermal Systems


HARTING

Jenoptik


A.P.O. - ELMOS v.o.s.

MACH SYSTEMS s.r.o.


Pico Technology

Lynred


Advantech

EBV


SECO S.p.A.

Crowd Supply


Digi-Key Electronics

Durakool


Calendary
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
 naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
   kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813