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Parker Hannifin
 

DANFOSS
 

MOXA
 

Alliance Memory

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Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
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International Engineering Fair, 4.-7.10. 2022, Brno, CZ
The MSV International Engineering Fair is the most important industrial fair in Central Europe. The majority of visitors are professionals. Nearly 80% of those in attendance exert influence on business investment, and one third form part of the top management of their firms.
congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs
Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power
congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change
75 YEARS OF MOTION
Our success story began in the late 1940s. In 1947, the young engineer Dr. Fritz Faulhaber founded "Feinmechanische Werkstätten" (Precision Mechanical Workshops), his first company. His customers included the renowned camera manufacturer Voigtländer, for whom he developed the "Vitessa" in the early 1950s.
OS-CON SERIES CAPACITORS BY PANASONIC
In an effort to miniaturise and increase the performance of electronic devices, in particular their power circuits, manufacturers are constantly looking for new, more efficient and compact electronic components.
congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular
formnext, 15.-18.11.2022, Frankfurt am Main, DE
Formnext shows the entire world of Additive Manufacturing and its upstream and downstream processes under one roof. This is just one of the reasons why it has developed rapidly in recent years and become the international meeting point for suppliers and users of industrial 3D Printing. In Frankfurt am Main as well as digitally.
SMTconnect, 9.-11.5.2023, Nuremberg, DE
SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
The PCIM Europe is the international leading exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
SPS Italia is the highlight event for the intelligent, digital and flexible industry. SPS Italia is the annual appointment to discuss the most challenging issues of tomorrow's industry, recognized as a reference point for the Italian manufacturing sector. The next edition will take place in Parma from 23 to 25 May 2023.
AMPER 2023, 21.-23.3.2023, Prague, CZ
29TH INTERNATIONAL TRADE FAIR OF ELECTROTECHNICS, ENERGETICS, AUTOMATION, COMMUNICATION, LIGHTING, AND SECURITY TECHNOLOGIES
Texas Instruments ADC354x Ultra-Low-Power ADCs Now at Mouser Electronics
Mouser Electronics, Inc. is now stocking ADC354x low-noise, ultra-low-power analog-to-digital converters (ADCs) from Texas Instruments.
“Invented for life” with semiconductors: Bosch invests further billions in chip business
Microelectronics is the future and is vital to the success of all areas of Bosch business. With it, we hold a master key to tomorrow’s mobility, the internet of things, and to what we at Bosch call technology that is ‘Invented for life’
Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).
USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets
New platform for electrifying mobile working machines: Bosch Rexroth presents “eLION”
The modular and scalable Rexroth eLION platform for the electrification of mobile machinery includes motor-generators, inverters, gearboxes, software and accessories as well as matching hydraulics.
congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers


Company of the week

INTEL

Interesting video


Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


DANFOSS

MOXA


Alliance Memory

Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH

Antenova Ltd


Friedrich Lütze GmbH

Analog Devices


ASRock Industrial

NVIDIA


Yamaichi Electronics USA Inc.

PICMG


Laird Thermal Systems

HARTING


Jenoptik

A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.

Pico Technology


Calendary
EMO Hannover, DE, 18.-23.09.2023
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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