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Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

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Lynred
 

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BAHCO set of insulated wrenches
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TDK announces world’s first MIPI standar
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Samsung Releases Portable SSD T7 Touch –
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120W eighth brick DC-DC converters for r


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Microchip’s TimeProvider 4100 Release 2.2 Grandmaster Provides a New Level of Redundancy, Resiliency and Security
IEEE 1588 precise timing grandmaster with gateway clock is the industry’s first to offer software-based redundancy

Uprated LinkSwitch AC-DC Converter ICs From Power Integrations Increase Available Current by 60%
High-efficiency LNK3207 ICs reduce BOM count and simplify buck converter design for appliances, sensors and metering applications

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

AEC-Q100 Qualified and Defense-grade PolarFire FPGAs Now Available in Volume Production
Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments

Nexperia and United Automotive Electronic Systems Co., Ltd. Agree Comprehensive Partnership for Gallium Nitride
Program will address the technical requirements for the power systems in electric vehicles

TME US, LLC. - TME'S FIRST US OFFICE IS NOW AVAILABLE TO CUSTOMERS.
Did you know that the TME Group created another (already eleventh!) subsidiary? We are pleased to announce that TME US, LLC has already started operations in Atlanta. It is the first subsidiary of TME in the United States. Our American dream is about to come true!

Lattice Expands mVision Solutions Stack Capabilities
Latest Release Supports State-of-the-Art Image Sensors for Industrial, Automotive, and Medical Applications

Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C Power and Data Adapter
Enables extended installation reach of USB Type-C devices while supporting a variety of input PoE standards up to 90W and output power up to 60W

Lattice Sentry Solutions Stack 2.0 Enhances Cyber Resiliency with New Expanded Capabilities
As the next step in its ongoing mission to deliver secure, cyber-resilient system control solutions, Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the latest version of its solutions stack for secure system control, Lattice Sentry™ 2.0.

Flat Mini ITX motherboard for Comet Lake processors
Behind the term PH11CMI hides a new motherboard from ICP Germany in the Thin Mini-ITX form factor, which supports the 10th generation of Intel® CoreTM processors. The mainboard in the classic size of 170 x 170 mm only has a height of 20 mm.

ARDUINO PRO – AN UNCONVENTIONAL, EASY WAY TO BUILD SUCCESSFUL IOT APPLICATIONS

Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters
Expansion of SA50-120 family introduces qualified 100V and 120V bus systems for space applications

Board-to-Board Connectors Designed and Tested for Special High-Speed Applications
The floating board-to-board connector system of the HF301 series is the perfect solution for connecting two PCBs. The floating mechanism allows for the smooth functioning even during shock and vibration. The HF301 is therefore intended for use under difficult environmental conditions.

Microchip Delivers Accuracy and Energy-efficiency of Current Monitoring in High-temperature Automotive Applications
New high-side current sense amplifier offers the industry’s lowest offset for AEC-Q100 Grade 0 qualified devices, enabling a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures

Advantech’s latest COM Express Type6 SOM-6883: Performance Breakthrough with 11th Gen. Intel® Core™ Processors and Advanced I/O Technology

Vishay Intertechnology Increases Resistance Ratios and Operating Voltages for ACAS AT Precision Thin Film Chip Resistor Arrays
Automotive Grade Devices Increase Design Capability in Voltage Divider and Signal Amplification Applications

Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package
Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC application

New Family of Ethernet Switches Provides the Industry’s Most Complete Time Sensitive Networking Feature Set
Microchip’s SparX-5i family of Ethernet switches enables increased connectivity and network optimization while lowering costs for industrial automation networks


Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
HANNOVER MESSE 2022, 30.5-2.6. 2022
CTiS Shanghai, 31.5.-2.6.2022
automatica 2022, München, 21.6.-24.6.2022
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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