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Seica
 

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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
Electronic-components


EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
DC CONVERTERS – WHAT ARE THEY AND WHAT ARE THEIR FUNCTIONS?
Voltage converters can decrease or increase the output voltage in relation to the input voltage. By alternately turning on and off the voltage with high frequency, they control the value of output voltage without causing any disturbance in the work of the device.
Power Integrations Introduces the InnoSwitch3-PD Family of Flyback Switcher ICs with Built-In USB PD Controller
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers
Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency
Power Integrations’ New SCALE-iFlex LT Plug-and-Play Gate Driver Improves EconoDUAL IGBT Module Performance by 20%
New gate driver eliminates one in six modules; substantially reduces system complexity
Power Integrations Introduces SCALE-iFlex Single Plug-and-Play Gate Drivers for “New Dual” Modules
SCALE-2 technology optimizes footprint, improves efficiency, performance and reliability of power inverters and converters to 3300 V
Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit
Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates
Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems
Advantech AIW-355 5G Module Accelerates the Next Wireless Transformation
Advantech release the newest member of the AIW-300 series — the AIW-355. This innovative 5G module marks a milestone for Advantech Industrial Wireless (AIW) and is designed for AIoT solutions that require ubiquitous connectivity, dynamic mobility, and extreme security. AIW-355 is an excellent choice for use in edge computing devices, mobile gateways, and diverse globally deployed mobile devices.
New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption
Lattice Certus-NX FPGAs Optimized for Automotive Applications
Best-in-class High I/O Density, Small Form Factor General Purpose FPGAs Based on Lattice Nexus Platform Now AEC-Q100 Qualified
New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols
Panasonic Industry adds high-current or high-voltage output models to its lineup of APV
Modern industrial automation solutions, energy systems and professional equipment are often extremely specialized devices that require high safety and design flexibility for switching elements like semiconductor relays. A photovoltaic driver for galvanic separation in combination with a distinct MOSFET power switch leaves nothing to be desired.
Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint
VELCRO® PRODUCTS NOW AVAILABLE AT TME
The TME offer has been expanded by products of the world-famous Velcro® brand. Velcro® was founded in 1951 and quickly became a dominant supplier of fastening solutions in a wide variety of industries. The company's offices are located in America, Asia, Europe, and Africa. The first Velcro® factory, opened in Manchester in 1957, is still there.
Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost
First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion
Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec

PULSIV


MikroElektronika d.o.o.

Panasonic Industry


Cambridge GaN Devices

Traco Power


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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