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Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r


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AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.

120W 1/8th brick DC-DC converter with 9-36Vdc range for industrial applications
Murata Electronics today announced that it has expanded its UWE family of DC-DC converters by Murata Power Solutions to include the UWE-Q12 series. This new product offers greater design flexibility because of the 9-36Vin range, 120 Watt rating, high efficiency, and cost effectiveness that it delivers.

KEMET Introduces Metal Composite Power Inductors for Automotive Applications
METCOM™ for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage

RS Components adds features, improves user interface in free-to-use DesignSpark PCB version 9
Now includes dangling connection report, net selection within pour area

SFP28 High-Speed Connector for Data Networking Optical Transceiver Applications
Yamaichi Electronics offers the SFP28 host connector for a data transmission rate of 56 Gbps PAM-4 modulation per one channel.

New Functional Safety Ready AVR® DA Microcontroller Family Enables Real-Time Control, Connectivity and HMI Applications
Next-generation AVR MCU family features core independent peripherals, advanced analog and on-chip communications

Murata Begins Mass Production of World's Smallest PTC Thermistor Contributing to Improving the Safety of Multifunctional Smartphones and Small Wearables

Microsoft Introduces New Surface Devices with Intel Core Processors
Today, Microsoft announced new Surface products powered by Intel® Core™ processors and designed to help you do what you need, from anywhere.

Microchip Announces the 53100A Phase Noise Analyzer for Precision Oscillator Characterization
Next-generation phase noise instrument combines timing technologies in a smaller, higher-performance measurement instrument

Murata and Google team to develop world’s smallest AI module with Coral intelligence
Murata announces that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint.

WEBINAR - Thu, May 14, 2020 6:00 PM - 7:00 PM CEST : Push Forward with the i.MX 8X Applications Processor for Automotive and Industrial Applications
NXP introduces the i.MX 8X applications processor to the mass market, the latest quad-core applications processor for secure, affordable and intelligent edge computing.

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.

10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.

Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.

An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.

Microchip Releases Version 2.1 of TimeProvider 4100 Timing Grandmaster
Precise timing grandmaster with gateway clock and fastest high-performance boundary clock enhances 5G mobile network phase protection

Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.


Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
HANNOVER MESSE 2022, 30.5-2.6. 2022
CTiS Shanghai, 31.5.-2.6.2022
automatica 2022, München, 21.6.-24.6.2022
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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