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Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
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Microchip and Innovium Deliver Industry’s Highest-Density Secured Ethernet Switching Solution for Hyperscale Data Centers and Telecom Service Providers
Demonstrated interoperability between industry’s highest-capacity Ethernet PHY from Microchip and Innovium’s widely adopted Ethernet switch
Vishay Intertechnology Launches Industry's First AEC-Q101 Qualified 60 V MOSFET in the PowerPAK® SO-8L Dual Asymmetric Package
Compact 5 mm by 6 mm Device Saves Space and Increases Efficiency in Switch Mode Power Supplies for Automotive Applications
KEMET Advances Hybrid Aluminum Polymer Capacitor Technology for Automotive and Industrial Applications
A780, PHA225, and PHH225 series offer high power density and low leakage in a compact, hybrid design
Microchip & EBV: EV Charging Solutions – Seminar Series
November 30 - December 3, 2020 - 14_00 CET each
Microchip’s High-Performance FPGA is First of its Kind to Achieve QML Class V in Ceramic Quad Flat Package
RTG4™ FPGAs offer a unique combination of radiation hardening by design, qualification to QML Class V and packaging that simplifies board design, inspection and assembly
Now at Mouser: Laird Connectivity's Sentrius IG60-BL654-LTE Wireless IoT Gateway for Smart Buildings
Mouser Electronics is now stocking the new Sentrius™ IG60-BL654-LTE wireless IoT gateway from Laird Connectivity. Featuring extensive connectivity capabilities, the Sentrius IG60-BL654-LTE gateway allows users to capture data from Bluetooth® 5-enabled sensors, augment the data with cloud-managed edge intelligence, and transmit it to the cloud via Wi-Fi 802.11ac Wave 2 with 2×2 MIMO or LTE wireless connectivity.
SUPERSEAL WATERPROOF CONNECTORS – HOW TO CRIMP AND CONNECT THEM PROPERLY
Superseal connectors from TE Connectivity are well-known thanks to their durability. They are widely used in the automotive and heavy industries, agriculture and wherever wires may be exposed to adverse conditions.
Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode (SBD) for Automotive Applications
Automotive Electronics Council (AEC)-Q101-qualified devices targeted at helping electric vehicles achieve the highest levels of reliability and ruggedness
Wearable connectivity solutions now easier to integrate into flexible structures
Fischer Connectors is enhancing the integration capability of its versatile plug & use Fischer Freedom™ Series.
Digi-Key Electronics to Distribute Mag Layers USA MMD Series Through the Digi-Key Marketplace
Digi-Key Electronics announced that it has expanded its product portfolio to include a global distribution of Mag Layers USA MMD series molded power inductors. This partnership is part of Digi-Key's global Marketplace initiative to broaden the product offering now available for customers, making Digi-Key more of a one-stop-shop than ever before.
Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
Software engineers can now map applications coded in C/C++ directly into PolarFire FPGAs and SoCs that are the industry’s lowest-power mid-range fabric solutions for acceleration
High capacity switching for next-gen automotive technology – new 60A-rated TT series from Panasonic Industry
When it comes to switching solutions, contemporary automotive application design resorts more and more to PCB mounted products. The primacy of miniaturization and efficiency without com-promises in terms of reliability and performance render THT or PiP mounted relays a perfect solution for multiple high current loads.
Siemens Energy and Siemens Mobility jointly drive development of hydrogen mobility
Siemens Energy and Siemens Mobility have signed a Memorandum of Understanding (MoU) to jointly develop and offer hydrogen systems for trains. The agreement was signed by Albrecht Neumann, CEO of Rolling Stock at Siemens Mobility and Armin Schnettler, Executive Vice President (EVP) of New Energy Business at Siemens Energy.
RS Components adds range of enhanced pressure and temperature indicators from Druck
The new DPI 705E range provides accurate, reliable pressure and temperature monitoring in industrial environments
Motor Development Kit from ON Semiconductor Prioritizes Energy Efficiency
New ecosystem for developing motor control solutions combines hardware, software and power modules for rapid development
Industry’s First Highly Integrated Radiation-Hardened Motor Controller Consolidates Essential Functions for the Motor Control and Position Sensing Circuitry of Satellite Elements into a Single Chip
Microchip’s LX7720 device increases reliability while reducing weight and board area
SECO launches SMARC Rel. 2.1 compliant module with NXP i.MX 8M Plus Processors for machine learning and vision applications
SECO, an NXP® Semiconductors Gold Partner, has always invested heavily in cooperation with NXP, to further strengthen our leadership strategy in designing and manufacturing state-of-the-art embedded solutions.
Now Available from Crowd Supply: PolarBerry’s Application-Flexible System-on-Module SBC
Crowd Supply, announces the launch of PolarBerry, a system-on-module (SoM) single board computer (SBC) utilizing the Microchip PolarFire system-on-a-chip (SoC). PolarBerry is a highly flexible solution that supports rapid commercial deployment for a range of applications, including low-power, real-time Linux applications.
Company of the week

INTEL

Interesting video


Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


DANFOSS

MOXA


Alliance Memory

Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH

Antenova Ltd


Friedrich Lütze GmbH

Analog Devices


ASRock Industrial

NVIDIA


Yamaichi Electronics USA Inc.

PICMG


Laird Thermal Systems

HARTING


Jenoptik

A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.

Pico Technology


Calendary
EMO Hannover, DE, 18.-23.09.2023
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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