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Panasonic Industry adds high-current or high-voltage output models to its lineup of APV
Modern industrial automation solutions, energy systems and professional equipment are often extremely specialized devices that require high safety and design flexibility for switching elements like semiconductor relays. A photovoltaic driver for galvanic separation in combination with a distinct MOSFET power switch leaves nothing to be desired.

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

VELCRO® PRODUCTS NOW AVAILABLE AT TME
The TME offer has been expanded by products of the world-famous Velcro® brand. Velcro® was founded in 1951 and quickly became a dominant supplier of fastening solutions in a wide variety of industries. The company's offices are located in America, Asia, Europe, and Africa. The first Velcro® factory, opened in Manchester in 1957, is still there.

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
Combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications
MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters
Adaptec® Smart Storage Adapters Provide Increased Performance, Security and Scalability While Simplifying Storage Management

INFRARED LEDS IN SMD PACKAGES
The TME catalogue includes a wide range of infrared LEDs. The noticeable market trend in favour of the miniaturisation of devices forces manufacturers to search for solutions combining high power (ca. 1W) with a small size of SMD components. For this reason, today we present one of such solutions: PK2S-series IR LEDs, which are the smallest SMD power diodes offered by ProLight.

New Ethernet PHYs Enable Multidrop Bus Architecture, Enhancing Industrial Networks’ Scalability and Functionality
Microchip’s LAN867x family of Ethernet PHYs is the first to implement the IEEE® 10BASE-T1S single-pair Ethernet technology standard for connecting devices in industrial networks

Farnell now stocking 3D printers from BCN3D Technologies
Customers can now achieve high quality production-grade 3D printing with BCN3D’s unique dual extrusion architecture and independent two-head design.

New Qi 1.3 Wireless Charging Reference Design Unveiled to Accelerate Development of Automotive and Consumer Qi Transmitter
Microchip’s Qi 1.3 reference design is compliant with the recently released Qi 1.3 specification and includes everything needed to quickly develop a Qi 1.3 certified transmitter

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products


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Traco Power

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GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


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ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA



Calendary
HKTDC Hong Kong Electronics Fair, 13.10.-16.10.2024
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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