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Access Point WBE750
 
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Nexperia launches AEC-Q101-qualified, leadless CAN-FD protection diodes with industry-leading ESD performance
Nexperia, the expert in essential semiconductors, has announced new leadless ESD protection devices for CAN-FD applications. Devices are available in leadless packages with side-wettable flanks that enable AOI tools to be used. Fully AEC-Q101-qualified, the PESD2CANFDx series parts also offer industry-leading ESD and RF performance, and save PCB space.
Design in line with the technology: FOXNEO
Standard product setting new standards. With the upcoming FOXNEO device family, FRIWO is completely redefining power supplies in terms of design.
Microchip Extends Leadership in Data Center Connectivity with Industry’s Lowest Latency PCI Express 5.0 and CXL 2.0 Retimers
XpressConnect retimers cost-effectively triple high-speed signal reach
Farnell expands range of XP Power products in-stock
Customers can now access a larger range of fully integrated, high efficiency and cost-effective power solutions for industrial, medical and domestic applications
1200 V level-shift three-phase SOI EiceDRIVER™ offers superior robustness
Infineon Technologies AG broadens its level-shift EiceDRIVER™ portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a more robust design with a compact form factor suitable for industrial drives and embedded inverter applications.
Microchip and Innovium Deliver Industry’s Highest-Density Secured Ethernet Switching Solution for Hyperscale Data Centers and Telecom Service Providers
Demonstrated interoperability between industry’s highest-capacity Ethernet PHY from Microchip and Innovium’s widely adopted Ethernet switch
Vishay Intertechnology Launches Industry's First AEC-Q101 Qualified 60 V MOSFET in the PowerPAK® SO-8L Dual Asymmetric Package
Compact 5 mm by 6 mm Device Saves Space and Increases Efficiency in Switch Mode Power Supplies for Automotive Applications
KEMET Advances Hybrid Aluminum Polymer Capacitor Technology for Automotive and Industrial Applications
A780, PHA225, and PHH225 series offer high power density and low leakage in a compact, hybrid design
Microchip & EBV: EV Charging Solutions – Seminar Series
November 30 - December 3, 2020 - 14_00 CET each
Microchip’s High-Performance FPGA is First of its Kind to Achieve QML Class V in Ceramic Quad Flat Package
RTG4™ FPGAs offer a unique combination of radiation hardening by design, qualification to QML Class V and packaging that simplifies board design, inspection and assembly
Now at Mouser: Laird Connectivity's Sentrius IG60-BL654-LTE Wireless IoT Gateway for Smart Buildings
Mouser Electronics is now stocking the new Sentrius™ IG60-BL654-LTE wireless IoT gateway from Laird Connectivity. Featuring extensive connectivity capabilities, the Sentrius IG60-BL654-LTE gateway allows users to capture data from Bluetooth® 5-enabled sensors, augment the data with cloud-managed edge intelligence, and transmit it to the cloud via Wi-Fi 802.11ac Wave 2 with 2×2 MIMO or LTE wireless connectivity.
SUPERSEAL WATERPROOF CONNECTORS – HOW TO CRIMP AND CONNECT THEM PROPERLY
Superseal connectors from TE Connectivity are well-known thanks to their durability. They are widely used in the automotive and heavy industries, agriculture and wherever wires may be exposed to adverse conditions.
Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode (SBD) for Automotive Applications
Automotive Electronics Council (AEC)-Q101-qualified devices targeted at helping electric vehicles achieve the highest levels of reliability and ruggedness
Wearable connectivity solutions now easier to integrate into flexible structures
Fischer Connectors is enhancing the integration capability of its versatile plug & use Fischer Freedom™ Series.
Digi-Key Electronics to Distribute Mag Layers USA MMD Series Through the Digi-Key Marketplace
Digi-Key Electronics announced that it has expanded its product portfolio to include a global distribution of Mag Layers USA MMD series molded power inductors. This partnership is part of Digi-Key's global Marketplace initiative to broaden the product offering now available for customers, making Digi-Key more of a one-stop-shop than ever before.
Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
Software engineers can now map applications coded in C/C++ directly into PolarFire FPGAs and SoCs that are the industry’s lowest-power mid-range fabric solutions for acceleration
High capacity switching for next-gen automotive technology – new 60A-rated TT series from Panasonic Industry
When it comes to switching solutions, contemporary automotive application design resorts more and more to PCB mounted products. The primacy of miniaturization and efficiency without com-promises in terms of reliability and performance render THT or PiP mounted relays a perfect solution for multiple high current loads.
Siemens Energy and Siemens Mobility jointly drive development of hydrogen mobility
Siemens Energy and Siemens Mobility have signed a Memorandum of Understanding (MoU) to jointly develop and offer hydrogen systems for trains. The agreement was signed by Albrecht Neumann, CEO of Rolling Stock at Siemens Mobility and Armin Schnettler, Executive Vice President (EVP) of New Energy Business at Siemens Energy.
Company of the week

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GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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