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New Ethernet PHYs Enable Multidrop Bus Architecture, Enhancing Industrial Networks’ Scalability and Functionality
Microchip’s LAN867x family of Ethernet PHYs is the first to implement the IEEE® 10BASE-T1S single-pair Ethernet technology standard for connecting devices in industrial networks
Farnell now stocking 3D printers from BCN3D Technologies
Customers can now achieve high quality production-grade 3D printing with BCN3D’s unique dual extrusion architecture and independent two-head design.
New Qi 1.3 Wireless Charging Reference Design Unveiled to Accelerate Development of Automotive and Consumer Qi Transmitter
Microchip’s Qi 1.3 reference design is compliant with the recently released Qi 1.3 specification and includes everything needed to quickly develop a Qi 1.3 certified transmitter
Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products
element14 Presents celebrates its 500th Episode and announces Winners of the Build Inside the Box Challenge
‘Build Inside the Box’ contestants participated in a competition that looked similar to Food Network’s ‘Chopped,’ a cooking challenge in which chef contestants must create a palatable dish using the ingredients they are given.
ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0
Microchip is First to Achieve JEDEC Qualification for a Radiation-Tolerant (RT) FPGA in a Plastic Package
Low-power RTG4 FPGA offers new space system designers the industry’s highest reliability at lowest cost with shortest lead times
New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.
LiPol rechargeable batteries for industrial applications
EEMB's 3.7V lithium-polymer batteries in an ultra-thin design, with high capacity, long life and low weight, are ideal for various mobile devices even in harsh industrial environments.
New Lattice Radiant 3.0 Design Software Further Enhances Ease of Use to Accelerate FPGA Designs
New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Highest Logic Density Lattice Nexus-Based Product Family Features Best-in-Class Power Efficiency, Performance, and Small Form Factor
First products from Nexperia’s new Manchester 8-inch wafer line are industry-leading Qrr Figure of Merit 80 V / 100 V MOSFETs
Nexperia announced that the first products to be made in the company’s new 8-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs using its latest NextPower silicon technology.
Innovative Ultra High Density Offline Power Solutions from ON Semiconductor
ON Semiconductor® announces industry’s first dedicated critical conduction mode (CrM) totem pole PFC controller as a new addition to their solution set for ultra-high density offline power supplies.
Pico Technology celebrates 30th anniversary with 30 years of continuous growth!
Today, Pico Technology celebrates 30 years of business. Pico’s oscilloscopes, data loggers and RF equipment are used by engineers, scientists and technicians around the globe to bring their products to market. Pico automotive diagnostics products help save time and money for vehicle manufacturers and service organisations on every continent.
NKK SWITCHES - QUALITY AND FUNCTIONALITY
Switches are electromechanical components that control the current flow by connecting and disconnecting the electrical circuit. Even the popularity of touch screens has not changed the fact that it is still the leading method of user-device interaction.
MPLAB® Cloud Tools Ecosystem Brings Secure, Platform-Independent Development Workflow to PIC® and AVR® Microcontrollers
New platform combines configuration and collaboration tools with knowledge-based search to modernize the embedded development workflow
Microchip Unifies Management of “Terrestrial Time” and “Live-Sky Time” Sources to Enable Resilient Timing for Critical Infrastructure
Company’s TimePictra® 11 timing infrastructure management system works with its BlueSky™ GNSS Firewall to create a unified view for a more secure network timing architecture
Automotive-Qualified Qspeed Silicon Diodes Feature Lowest Qrr for Efficient, High-Switching-Speed Designs
600 V 12 A diodes can replace SiC parts in automotive applications
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Texas Instruments

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electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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Texas Instruments

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MikroElektronika d.o.o.


Panasonic Industry

Cambridge GaN Devices


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KEYENCE

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INTEL

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Giada

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Digi-Key Electronics

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Danisense


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Parker Hannifin


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MOXA


Alliance Memory

Intelliconnect (Europe) Ltd.


Calendary
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
asiamold select, Guangzhou, CHN, 25.-27.2.2025
embedded world 2025, Nuremberg, 11.–13.3.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

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The ISS Design Challenge ...


Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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