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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
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World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.
AEC-Q100 Qualified and Defense-grade PolarFire FPGAs Now Available in Volume Production
Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments
Nexperia and United Automotive Electronic Systems Co., Ltd. Agree Comprehensive Partnership for Gallium Nitride
Program will address the technical requirements for the power systems in electric vehicles
TME US, LLC. - TME'S FIRST US OFFICE IS NOW AVAILABLE TO CUSTOMERS.
Did you know that the TME Group created another (already eleventh!) subsidiary? We are pleased to announce that TME US, LLC has already started operations in Atlanta. It is the first subsidiary of TME in the United States. Our American dream is about to come true!
Lattice Expands mVision Solutions Stack Capabilities
Latest Release Supports State-of-the-Art Image Sensors for Industrial, Automotive, and Medical Applications
Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C Power and Data Adapter
Enables extended installation reach of USB Type-C devices while supporting a variety of input PoE standards up to 90W and output power up to 60W
Lattice Sentry Solutions Stack 2.0 Enhances Cyber Resiliency with New Expanded Capabilities
As the next step in its ongoing mission to deliver secure, cyber-resilient system control solutions, Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the latest version of its solutions stack for secure system control, Lattice Sentry™ 2.0.
Flat Mini ITX motherboard for Comet Lake processors
Behind the term PH11CMI hides a new motherboard from ICP Germany in the Thin Mini-ITX form factor, which supports the 10th generation of Intel® CoreTM processors. The mainboard in the classic size of 170 x 170 mm only has a height of 20 mm.
ARDUINO PRO – AN UNCONVENTIONAL, EASY WAY TO BUILD SUCCESSFUL IOT APPLICATIONS
Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters
Expansion of SA50-120 family introduces qualified 100V and 120V bus systems for space applications
Board-to-Board Connectors Designed and Tested for Special High-Speed Applications
The floating board-to-board connector system of the HF301 series is the perfect solution for connecting two PCBs. The floating mechanism allows for the smooth functioning even during shock and vibration. The HF301 is therefore intended for use under difficult environmental conditions.
Microchip Delivers Accuracy and Energy-efficiency of Current Monitoring in High-temperature Automotive Applications
New high-side current sense amplifier offers the industry’s lowest offset for AEC-Q100 Grade 0 qualified devices, enabling a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures
Advantech’s latest COM Express Type6 SOM-6883: Performance Breakthrough with 11th Gen. Intel® Core™ Processors and Advanced I/O Technology
Vishay Intertechnology Increases Resistance Ratios and Operating Voltages for ACAS AT Precision Thin Film Chip Resistor Arrays
Automotive Grade Devices Increase Design Capability in Voltage Divider and Signal Amplification Applications
Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package
Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC application
New Family of Ethernet Switches Provides the Industry’s Most Complete Time Sensitive Networking Feature Set
Microchip’s SparX-5i family of Ethernet switches enables increased connectivity and network optimization while lowering costs for industrial automation networks
Inkplate 10, Now at Crowd Supply, Uses Recycled E-Paper Displays with Wi-Fi Support and Low Power Performance
Crowd Supply announces the launch of Inkplate 10, a Wi-Fi-enabled, ESP32-based board with a recycled 9.7-inch e-paper display. Inkplate 10 uses recycled e-paper screens from Kindles and other e-readers, delivering benefits such as high contrast, impressive energy efficiency, and daylight readability.
congatec to solve ruggedization challenges of edge server and client designs
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC
Company of the week

NeoCortec

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electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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NeoCortec

PULSIV


MikroElektronika d.o.o.

Panasonic Industry


Cambridge GaN Devices

Traco Power


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara

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