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ChipConnect™ Cable Assemblies
TE Connectivity AMP's ChipConnect internal faceplate-to-processor cable assemblies are required for Intel® Omni-Path Architecture (OPA). In the CPU processor, these cable assemblies mate directly with LGA 3647 sockets at the processor and Intel internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds.

Mouser Signs Global Agreement with Keysight Technologies
Mouser Electronics, Inc. announces a global agreement with Keysight Technologies, a company focused on helping organizations solve electronic design and test and measurement challenges through a combination of trusted hardware, innovative software, and a global team of industry experts.

C4AT/C44H/C44P/C20A Series for PFC and AC Filter
KEMET’s AC filter metallized polypropylene film capacitors come in radial or cylindrical aluminum can types and have temperature ratings of +75ºC to +85ºC. Capacitance values range from 0.22 μF to 600 μF with a voltage range from 160 VAC to 1,000 VAC.

Murata's nRF52-Based WSM-BL241 Bluetooth 5 Module Now Shipping from Mouser Electronics
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the WSM-BL241 Bluetooth® low energy module from Murata. Based on a Nordic nRF52832 system-on-chip (SoC), the WSM-BL241 offers ultra-low-power Bluetooth 5 functionality in a small package, ideal for Internet of Things (IoT), asset-tracking, beacon, and medical applications.

Microsemi SmartFusion2 Maker Board Available Worldwide Exclusively from Digi-Key
Microsemi has teamed up with Digi-Key Electronics to provide the SmartFusion™2 system-on-chip (SoC) field programmable gate array (FPGA) maker board exclusively to Digi-Key’s global customer base. This low-cost evaluation platform lowers the barrier for hardware and firmware engineers to develop embedded applications for the ARM Cortex™-M3 and 12K logic elements (LE) FPGA fabric in the SmartFusion2 device. Contents include the new SmartFusion2 board, a USB cable to provide power, programming and communication, and a QuickStart Guide.

UCC256303 LLC Resonant Controller
Texas Instruments' UCC256303 is a fully featured LLC controller with integrated high-voltage gate driver. It has been designed to pair with a PFC stage to provide a complete power system using a minimum of external components. The resulting power system is designed to meet the most stringent requirements for standby power without the need for a separate standby power converter, and with PFC stage running all the time.

3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.

Samsung C-Lab to Reveal Creative New Projects at CES 2018
Samsung Electronics announced today that, at CES 2018, it will introduce three innovative new projects, developed from its C-Lab (Creative Lab) program. In addition, seven start-ups which have been spun off from C-Lab will showcase their newly released commercial products at CES to explore new business opportunities.

Mouser Now Stocking Maxim DS28E38 DeepCover ECDSA Authenticator for Flexible, Asymmetric Security
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the DS28E38 DeepCover® secure ECDSA authenticator from Maxim Integrated.

MSP-EXP430FR2433 LaunchPad™ Development Kit
Texas Instruments' MSP-EXP430FR2433 LaunchPad development kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2433 value line sensing microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR2x value line sensing MCU platform, including on-board debug probe for programming, debugging, and energy measurements.

Mouser Signs Agreement with RushUp to Distribute KITRA and JAM Product Accelerator Boards for IoT
Mouser Electronics, Inc. announces a distribution agreement with RushUp, creator of innovative product accelerator boards for makers, developers, and high-mix/low-volume companies that want to quickly incorporate Internet of Things (IoT) technologies into their products. Through the agreement, Mouser will distribute RushUp's KITRA and JAM board solutions.

element14 Community Announces ‘IoT on Wheels’ Design Challenge Winners
element14 community members recognized for creating innovative IoT transportation solutions with boundary-pushing prototypes

C4AS/C4BS Series Power Film Capacitors
KEMET’s snubber power film metallized polypropylene capacitors are radial type capacitors with temperature ranges of -40ºC to +85ºC. Capacitance values range from 0.022 μF to 5.0 μF with a voltage range from 850 VDC / 550 VAC to 1,300 VDC / 750 VAC.

ON Semi's Flexible RSL10 SoC, Now Shipping from Mouser, Ideal for IoT and Connected Health Wearables
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the RSL10 multi-protocol system-on-chip (SoC) from ON Semiconductor.

XFC Series Step-Down Transformers
ERP Power XFC series of slimline stepdown transformers is designed for use in commercial, industrial, and outdoor lighting applications, where the mains power is 480 VAC (industrial, outdoor) or 347 VAC (Canada) and the required output is 277 VAC. This series is optimized for use with universal input (120 VAC to 277 VAC) LED drivers. All products are UL recognized components for US and Canada unless otherwise specified. Efficiency is typically greater than 90%.

Cloud-Compatible Wi-Fi Modules
The SPWF04 Cloud-compatible Wi-Fi module from STMicroelectronics is set to accelerate development of all kinds of IoT and M2M devices. The module provides advanced Internet-security and application protocols, and features a microcontroller capable of supporting operation in standalone or serial-to-Wi-Fi modes.


Company of the week

INTEL

Interesting video


Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology



Calendary
EMO Hannover, DE, 18.-23.09.2023
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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