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TGW-Q14BB-FCQ 100 Gigabit Optical Transceiver
Formerica’s TGW-Q14BB-FCQ is a 4-lane aggregated 100 Gbps optical pluggable transceiver designed for optical communication applications compliant with IEEE 802.3ba 100GBase-LR4 and QSFP28 MSA. The TGW-Q14BB-FCQ supports long reach of 10 km on single mode fiber.

Mouser Signs Global Agreement with SensiEDGE to Distribute SensiBLE Module and Development Kit for IoT-Ready Apps
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with SensiEdge, developer and manufacturer of the SensiBLE family of board-level Internet of Things (IoT) modules and development tools.

Mouser- and Molex-Sponsored Formula E Team Preps for Marrakesh E-Prix
TTI Joins Molex and Mouser in Supporting Electric Car Tech for Fourth Consecutive Year

Sigfox SDR Dongle Developers’ Platform Available Globally from Digi-Key
The Sigfox SDR dongle, designed for device and solution makers to speed up development and tests, is now available globally through Digi-Key Electronics, a global electronic components distributor. The SDR dongle allows for development of Sigfox devices independent from Sigfox public network coverage.

JVA Series Renewable Energy DC/DC Converters
XP Power’s JVA15 and JVA40 series of DC/DC converters are for renewable energy and industrial applications that require fully encapsulated DC/DC converters. They are available in either PCB or DIN rail mount versions. All models accept the ultrawide input range from 200 VDC to 1500 VDC that is common in a number of renewable and industrial applications.

Now at Mouser: UDOO’s BLU Sense Module Provides Bluetooth, Zigbee Extension for IoT Platforms
Mouser Electronics, Inc., the New Product Introduction (NPI) leader that empowers innovation, is now stocking the BLU Sense module from UDOO. Fully compatible with UDOO X86 single board computers, the versatile and affordable BLU Sense module provides an ideal wireless I/O extension for Internet of Things (IoT) platforms.

Fujitsu Chooses Lattice’s SiBEAM Snap Wireless Connector Technology to Simplify USB Connections in Next-Generation Tablet PC
Lattice’s SB6212 and SB6213 USB3 Devices Improve Ease of Use and Reliability of Connecting the Tablet to the Docking Cradle

ADIS16470/ADIS16475/ADIS16477 Mini Mems IMU ±2000°/sec
ADI’s ADIS16470, ADIS16475, and ADIS16477 are complete inertial measurement unit (IMU) systems that includes a triaxis gyroscope and a triaxis accelerometer. Each inertial sensor combines industry leading iMEMS® technology with signal conditioning that optimizes dynamic performance.

Panasonic PAN1326C Bluetooth 4.2 Module Now at Mouser Electronics
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the PAN1326C Bluetooth® 4.2 module from Panasonic.

Provide Secure Authentication with NXP's Ultra-Low-Power A1006 Device, Now at Mouser
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the A1006 Secure Authenticator IC from NXP Semiconductors.

ChipConnect™ Cable Assemblies
TE Connectivity AMP's ChipConnect internal faceplate-to-processor cable assemblies are required for Intel® Omni-Path Architecture (OPA). In the CPU processor, these cable assemblies mate directly with LGA 3647 sockets at the processor and Intel internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds.

Mouser Signs Global Agreement with Keysight Technologies
Mouser Electronics, Inc. announces a global agreement with Keysight Technologies, a company focused on helping organizations solve electronic design and test and measurement challenges through a combination of trusted hardware, innovative software, and a global team of industry experts.

C4AT/C44H/C44P/C20A Series for PFC and AC Filter
KEMET’s AC filter metallized polypropylene film capacitors come in radial or cylindrical aluminum can types and have temperature ratings of +75ºC to +85ºC. Capacitance values range from 0.22 μF to 600 μF with a voltage range from 160 VAC to 1,000 VAC.

Murata's nRF52-Based WSM-BL241 Bluetooth 5 Module Now Shipping from Mouser Electronics
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the WSM-BL241 Bluetooth® low energy module from Murata. Based on a Nordic nRF52832 system-on-chip (SoC), the WSM-BL241 offers ultra-low-power Bluetooth 5 functionality in a small package, ideal for Internet of Things (IoT), asset-tracking, beacon, and medical applications.

Microsemi SmartFusion2 Maker Board Available Worldwide Exclusively from Digi-Key
Microsemi has teamed up with Digi-Key Electronics to provide the SmartFusion™2 system-on-chip (SoC) field programmable gate array (FPGA) maker board exclusively to Digi-Key’s global customer base. This low-cost evaluation platform lowers the barrier for hardware and firmware engineers to develop embedded applications for the ARM Cortex™-M3 and 12K logic elements (LE) FPGA fabric in the SmartFusion2 device. Contents include the new SmartFusion2 board, a USB cable to provide power, programming and communication, and a QuickStart Guide.

UCC256303 LLC Resonant Controller
Texas Instruments' UCC256303 is a fully featured LLC controller with integrated high-voltage gate driver. It has been designed to pair with a PFC stage to provide a complete power system using a minimum of external components. The resulting power system is designed to meet the most stringent requirements for standby power without the need for a separate standby power converter, and with PFC stage running all the time.

Samsung C-Lab to Reveal Creative New Projects at CES 2018
Samsung Electronics announced today that, at CES 2018, it will introduce three innovative new projects, developed from its C-Lab (Creative Lab) program. In addition, seven start-ups which have been spun off from C-Lab will showcase their newly released commercial products at CES to explore new business opportunities.

3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.


Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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