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New LFPAK56 MOSFETs from Nexperia feature improved creepage and clearance, meeting UL2595
Nexperia announced that two of its LFPAK56-packaged portfolio of MOSFETs are now available with improved creepage and clearance to meet UL2595 requirements for battery-powered equipment rated between 15 and 32 V.

Devices are 100% compatible with the industry-standard Power-SO8 footprint; no other compact, surface-mount devices yet meet UL2595 which calls for minimum creepage and clearance distances of 1.5mm between Source and Drain terminals.

Unlike some competing Power-SO8 types which are constructed using wire bonding, Nexperia’s LFPAK56 package uses a copper clip which is soldered in a single operation to the surface of the die. This reduces spreading resistance and gives LFPAK56 superior electrical and thermal characteristics as well as increased reliability. The new PSMN0R9-30ULD and PSMN1R0-40ULD N-channel MOSFETs in the enhanced SOT1023A package feature a creepage distance of 1.5mm and a clearance distance of 1.55mm. The PSMN0R9-30ULD device is rated at 30 V, offering 0.87 mΩ and 300 A, the PSMN1R0-40ULD is rated at 40 V, with 1.1 mΩ and 280 A.

Comments Eric Su, International Product Marketing Manager: “UL2595 is an important US standard which could well be adopted by other international regulatory bodies. Also, equipment manufacturers prefer to design one global product that meets the toughest standard, rather than have multiple versions for different geographic locations. Therefore it is important that designers are aware that regular Power-SO8 devices will not pass UL2595, but that there is a compliant drop-in replacement available.”

The PSMN0R9-30ULD and PSMN0R9-40ULD MOSFETs are part of Nexperia’s NextPowerS3 family of devices that offer a combination of low RDS(on), high maximum current and strong safe operating area (SOA), perfect for battery-powered motor control applications.

For more information, please visit: https://efficiencywins.nexperia.com/innovation/innovating-to-meet-changing-standards-UL2925.html

2018060801 / 13.06.2018 / Electronic-components / NEXPERIA /

Extended NextPower 80/100V MOSFET portfolio from Nexperia offers increased design flexibility

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

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