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Nexperia’s new ESD protection series for USB Type-C deliver industry’s highest surge robustness and lowest trigger voltage
Nexperia announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the system chip.

Nexperia’s TrEOS ESD protection technology uses active silicon-controlled rectification to deliver a winning combination of extremely low capacitance (down to 0.1 pF); extremely low clamping (dynamic resistance down to 0.1 Ω) and very high robustness against surge and ESD pulses (up to 20A 8/20 µs for very fast datalines). Turn-on time is also very fast at about 0.5 ns and devices can withstand up to 30 kV contact discharge, exceeding IEC 61000-4-2, level 4. TrEOS devices for applications where the protection is placed before the capacitor are now available with industry’s leading peak pulse current ratings of 9.5, 15 and 20 A for 8/20 IEC61000-4-5 conditions. TrEOS devices for use after the capacitor similarly deliver industry-leading performance, featuring the lowest trigger voltages (Vt1), down to 4.3 V. These features are also relevant for USB Type-A and MicroUSB interfaces.

Comments Stefan Seider, product manager at Nexperia: “The options offered by USB Type-C and USB Power Delivery are very attractive: To ensure that end customers can enjoy data speeds of up to 20 Gbps and up to 100 W charging, Nexperia offers two TrEOS protection families that support every protection strategy around the new USB3.2 Rx capacitor for protecting sensitive transceivers against possible fault conditions.”

TrEOS protection diodes are packaged in the widely-used 0603 form factor. Advantages of the very compact, very robust DSN0603-2 (SOD962-2) package include the lack of bond wires, which eliminates another failure mode and results in the lowest inductance for fastest protection. This package is very popular for mobile and computing applications. Further space-saving packages are also available. Nexperia has provided a comprehensive parametric USB protection search guide (click here) to help designers choose the optimal device for their system configuration.

For more information on Nexperia’s TrEOS ESD protection click here.

2018072102 / 20.07.2018 / Electronic-components / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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