FREISING, Germany (Sept. 4, 2018) – At electronica 2018 in Munich, Germany, Texas Instruments (TI) will reveal how it is “designing tomorrow” for the automotive and industrial markets through advancements in analog and embedded processing integrated circuits (ICs). TI will showcase technology for the future of smart driving, smart buildings and smart factories with interactive demonstrations and presentations. Visitors will also have the chance to sit down with TI engineering experts to learn about the company’s latest groundbreaking innovations.

Smart driving

Automobile designers want technologies that maximize the driving distance per charge, improve vehicle perception and driver visibility, and enhance passenger comfort and convenience. Attendees will interact with the latest automotive innovations at electronica, where TI will present advancements for vehicle electrification, the digital cockpit, the connected car, autonomous driving technology and more. The demonstration will highlight innovation for off- and on-board charging of electric vehicles (EVs), lighting, interior body sensors, and advanced driver-assistance systems (ADAS).

Smart buildings

Companies continue to add more electronics to building designs to make them smarter, safer, more efficient and more connected. Attendees will experience the latest building automation innovations at electronica, where TI will show how companies can incorporate intelligent detection, using next-generation sensing capabilities and connectivity technology that supports multiple wireless protocols, including Bluetooth®, Thread®, Zigbee®, WiFi® and more.

Smart factories

As Industrial IoT becomes prevalent in factory designs, manufacturers need smarter technologies to help predict, detect and transmit data to the cloud and from machine to machine. In TI’s Industry 4.0 demonstration area, visitors will be able to see what’s next in industrial automation, robotics, predictive maintenance, machine vision and more. Visit the TI booth to try out new products and fully tested reference designs, including real-time time-sensitive network (TSN) technology, TI mmWave sensing and IO-Link communication.

Powering, controlling, sensing, connecting and more…

Attendees will be able to take part in an engineer-to-engineer experience with TI experts at four technology workbenches, featuring power management, sensors, wireless connectivity, MCUs and processors. For example, TI engineers will showcase GaN technology innovation for power design, ultrasonic sensing, and hands-on demonstrations featuring TI’s SimpleLink™ MCU products.

Beyond the TI booth at electronica

Visitors can also learn from TI experts in one or all of the following presentations at the show.

Wednesday, November 14:

“Industry 4.0 embedded processor platform with integrated time sensitive network (TSN),” by Thomas Leyrer, applications manager for factory automation systems.
“Multi-protocol wireless communication,” by Ben Gilboa, , low-power RF system engineer, and Priya Thanigai, low-power RF marketing manager.
“IoT – Low-power embedded WiFi,” by Uri Weinrib, MCU applications engineer.
“Sensor-to-Cloud connection made simple with intelligent gateway,” by Sai Reddy, MCU applications engineer.
“More than just car talk: How automotive technology is scaling to industrial vehicles,” by Prajakta Desai, product marketing manager for industrial radar.

Thursday, November 15:

“Implementing a secure OTA update application for wireless MCU devices,” by Nicholas Lethaby, MCU systems engineer.
Tech Talks session: Industrial IoT panel with Miro Adzan, general manager for TI’s factory automation systems.

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