Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

20.11.2024 0:07:20
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market

As firmware updates and larger media files become more prevalent in automotive entertainment consoles, faster data rates are required to reduce upload and download times. Microchip Technology Inc. (Nasdaq: MCHP) today announced an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal connectivity in vehicles, the USB7002 SmartHub IC includes interfaces for USB Type-C connectors.

As automotive manufacturers continue to add more functions to vehicles and integrate with mobile phone applications, the role of USB for reliable data transfers requires robust functionality and faster transfer speeds. Consumers expect instant responses from infotainment systems despite many functions occurring simultaneously in vehicles, from transferring mapping data to playing music and interacting with user interfaces. The 5 Gbps SuperSpeed data rates of USB 3.1 ensure higher bandwidth and maximum functionality, making it well suited for applications that require gigabit speeds for faster data streaming, data download and in-vehicle communication. The USB7002 also reduces the download time for large videos, which is ideal for vehicles that have integrated 4K dash cams.

Consumer demand for faster mobile device charging has led to the rise of USB Type-C in the smartphone industry. The USB7002 combines the benefits of USB 3.1 technology with the rising popularity of USB Type-C. The USB7002 enables direct USB Type-C connections through native Configuration Channel (CC) pin interfaces and integrated 2:1 multiplexers that support the reversible connection feature of the USB Type-C connector. 

“Microchip continues to invest in bringing devices to market that are at the forefront of USB technology in the automotive industry,” said Charles Forni, general manager of Microchip’s USB and Networking business unit. “From providing faster charging for mobile devices in the car console and backseat to introducing the industry’s first automotive USB 3.1 solution with USB Type-C compatibility, we continue to offer solutions that enhance the in-vehicle experience.”

To support the driver assistance applications that are now standard on all mobile handsets, the SmartHub ICs also include Microchip’s patented FlexConnect technology, which provides the unique ability to dynamically swap between a USB host and USB device. The SmartHub ICs also feature patented multi-host end-point reflector technology, which enables USB data to be mirrored between two USB hosts. These fundamental features enable the graphical user interface of a phone to be displayed on the vehicle’s screen and integrate with voice commands inside the car, while simultaneously charging the mobile device. This allows consumers to easily and safely use their mobile devices while driving, providing a user-friendly way to make calls, send messages and get directions while focusing on the road.  

“Consumers expect infotainment systems in today’s vehicles to instantly respond without any delay,” said Dave Atkinson, director of business development, connected mobility solutions, Molex. “We leveraged Microchip’s USB7002 with 5 Gbps SuperSpeed data rates to ensure maximum functionality in our automotive media hub.”

Development Tools

The USB7002 IC comes with a complete solution including the MPLAB® Connect Configurator hub configuration tool, evaluation boards with schematics and gerbers to reduce development time. Microchip’s USBCheck™ services allow manufacturers to verify designs and layouts prior to sending out a PCB for manufacturing, significantly accelerating time to market for their end products.  

Pricing and Availability

The USB7002-I/KDXVA0 is AEC-Q100 Grade 3 qualified and available now starting at $4.05 in volume production quantities. For additional information and to purchase products mentioned here, contact a Microchip sales representative or authorized worldwide distributor.

2019041003 / 16.04.2019 / Electronic-components / Microchip Technology Inc. /

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions

Microchip Releases 20 Advanced Wi-Fi® Products for Industrial and Commercial Applications
Company’s wireless connectivity portfolio represents one of the industry’s most extensive selection of Wi-Fi solutions and comprehensive support systems

New VelocityDRIVE™ Software Platform and Automotive-Qualified Multi-Gigabit Ethernet Switches for Software-Defined Vehicles

New Family of Voltage-Controlled Saw Oscillators With Ultra-Low Phase Noise Performance for Radar Applications
Microchip’s VCSO 101765 devices are available in 320 MHz and 400 MHz with a small form factor

New Solution from Microchip Makes it Easier to Build Sophisticated Graphical User Interfaces for MPLAB® Harmony v3 and Linux® Environments

Functional Safety Certification for Microchip’s PolarFire® FPGAs Speeds Time to Market
Certified tool flow and safety data package available for both IEC 61508 SIL 3 and ISO 26262 ASIL D standards

Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability
Microchip’s LAN887x PHYs offer extended reach up to 40m and are designed to be compliant with industry standards

Microchip Technology Adds ECC20x and SHA10x Families of Secure Authentication ICs to TrustFLEX Platform
Pre-Configured CryptoAuthentication™ ICs help reduce development time and minimize design costs

Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.

Pick Your Power with Microchip’s New Electric Vehicle Charger Reference Designs
Flexible and scalable EV charger reference designs are designed to meet unique regional requirements

Microchip Introduces High-Performance PCIe® Gen 5 SSD Controller Family
Flashtec® NVMe® 5016 controllers are optimized to manage growing enterprise and data center workloads

Microchip Technology Introduces a New Core in the dsPIC® Digital Signal Controller Family to Enhance Precision and Execution of Real-Time Control

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813