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WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.

With 5G now being rolled out around the world we can expect these developments to ramp up further – with the global market projected to be worth $320bn by 2026. But, as companies seek to seize these opportunities, they must balance the development time and costs, and mitigate risk by ensuring the highest levels of safety.

In this webinar, hosted by OpenSynergy, Mobica, ACTIA and NXP, we will explore:

  • Requirements and challenges in the telematics industry
  • How virtualisation addresses today’s challenges in the industry
  • NXP Automotive i.MX 8X Application Processors for Telematics
  • The highly specialised engineering competency that enables scalability

These companies will also discuss their recent collaboration on a Telematics Control Unit (TCU) – an embedded system that connects a vehicle’s external and internal world. The TCU provides a platform for multiple applications, including services such as eCall crash notification, stolen vehicle tracking and wireless access point as well as vehicle data exchange for diagnostic purposes.

Register now for the free, one hour-long talk to listen and to discuss.

NXP and ZF Collaborate on SiC-Based Traction Inverters to Boost Electric Vehicle Powertrains

NXP Introduces Automotive Secure Element for Smart Key Fobs
NXP’s first automotive-qualified Secure Element with NFC and wired interfaces for smart fobs for keyless entry and various security-critical applications helps increase the security of smart connected cars.

WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.

WEBINAR: NXP Introduces New MIFARE DESFire EV3 IC
JUNE 16, 2020 | 60-MINUTE WEBINAR | 9:00 AM CEST

NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
NXP Semiconductors today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era of security and connectivity in smart city services.

WEBINAR - Thu, May 14, 2020 6:00 PM - 7:00 PM CEST : Push Forward with the i.MX 8X Applications Processor for Automotive and Industrial Applications
NXP introduces the i.MX 8X applications processor to the mass market, the latest quad-core applications processor for secure, affordable and intelligent edge computing.

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NeoCortec

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electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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