Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

21.11.2024 9:08:15
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode (SBD) for Automotive Applications
Automotive Electronics Council (AEC)-Q101-qualified devices targeted at helping electric vehicles achieve the highest levels of reliability and ruggedness

As vehicle electrification continues rapid growth worldwide, innovative power technologies such as Silicon Carbide (SiC) are required for high-voltage automotive systems ranging from motors to on-board charging and DC/DC converters. Microchip Technology Inc. (Nasdaq: MCHP) today announced its newly-qualified 700 and 1200V SiC Schottky Barrier Diode (SBD) power devices, providing Electric Vehicle (EV) system designers with solutions that meet stringent automotive quality standards across a wide range of voltage, current and package options.

For EV power designers who need to increase system efficiency while maintaining high quality, Microchip’s AEC-Q101-qualified devices maximize system reliability and ruggedness and enable stable and lasting application life. The devices’ superior avalanche performance allows designers to reduce the need for external protection circuits, reducing system cost and complexity.

“As a long-time supplier to the automotive industry, Microchip’s continued expansion of automotive-capable power solutions is leading the transformation of power systems in vehicle electrification,” said Leon Gross, vice president of Microchip’s discrete product business unit. “Our focus is to provide automotive solutions that help our clients easily transition to SiC while minimizing the risk of quality, supply and support challenges.”

Microchip has been a supplier to the automotive industry for more than 25 years. The company’s SiC technology, as well as its multiple IATF 16949:2016-certified fabrication facilities, provide high-quality devices through flexible manufacturing alternatives, helping minimize risk in the supply chain. 

Through Microchip internal and third-party testing, critical reliability metrics have proven Microchip devices’ superior performance when compared to other SiC manufactured devices. Unlike other SiC devices that degrade under extreme conditions, Microchip devices have demonstrated no degradation in performance, increasing the application life. Microchip SiC solutions lead the industry in reliability and ruggedness. The company’s SiC SBD ruggedness testing demonstrates 20 percent higher energy withstand in Unclamped Inductive Switching (UIS), and among the lowest leakage currents at elevated temperatures, increasing system life and enabling a more reliable operation.

Microchip’s SiC automotive power devices complement its broad portfolio of controllers, analog and connectivity solutions providing designers with total system solutions for electric vehicles and charging stations. Microchip also provides a broad portfolio of 700, 1200 and 1700V SiC SBD and Metal Oxide Silicon Field Effect Transistor (MOSFET) power modules utilizing its newest generation of SiC die. In addition, its dsPIC® digital signal controllers deliver performance, low power consumption and flexible peripherals. Microchip’s AgileSwitch® family of digital programmable gate drivers further accelerates the process of moving from the design stage to production. These solutions also have applications across renewable, grid, industrial, transportation, medical, data center and aerospace and defense systems.

Development Tools

Microchip’s AEC-Q101-qualified SiC SBD devices are supported with SPICE and PLECS simulation models and MPLAB® Mindi Analog Simulator. Also available is a PLECS reference design model that uses Microchip’s SBDs (1200V, 50A) as part of the power stage — the Vienna 3-Phase Power Factor Correction (PFC) reference design.

Pricing and Availability

Microchip’s AEC-Q101 qualified 700 and 1200V SiC SBD devices (also available as die for power modules) for automotive applications are available now for volume production orders. For additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website.

2020111801 / 19.11.2020 / Electronic-components / Microchip Technology Inc. /

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions

Microchip Releases 20 Advanced Wi-Fi® Products for Industrial and Commercial Applications
Company’s wireless connectivity portfolio represents one of the industry’s most extensive selection of Wi-Fi solutions and comprehensive support systems

New VelocityDRIVE™ Software Platform and Automotive-Qualified Multi-Gigabit Ethernet Switches for Software-Defined Vehicles

New Family of Voltage-Controlled Saw Oscillators With Ultra-Low Phase Noise Performance for Radar Applications
Microchip’s VCSO 101765 devices are available in 320 MHz and 400 MHz with a small form factor

New Solution from Microchip Makes it Easier to Build Sophisticated Graphical User Interfaces for MPLAB® Harmony v3 and Linux® Environments

Functional Safety Certification for Microchip’s PolarFire® FPGAs Speeds Time to Market
Certified tool flow and safety data package available for both IEC 61508 SIL 3 and ISO 26262 ASIL D standards

Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability
Microchip’s LAN887x PHYs offer extended reach up to 40m and are designed to be compliant with industry standards

Microchip Technology Adds ECC20x and SHA10x Families of Secure Authentication ICs to TrustFLEX Platform
Pre-Configured CryptoAuthentication™ ICs help reduce development time and minimize design costs

Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.

Pick Your Power with Microchip’s New Electric Vehicle Charger Reference Designs
Flexible and scalable EV charger reference designs are designed to meet unique regional requirements

Microchip Introduces High-Performance PCIe® Gen 5 SSD Controller Family
Flashtec® NVMe® 5016 controllers are optimized to manage growing enterprise and data center workloads

Microchip Technology Introduces a New Core in the dsPIC® Digital Signal Controller Family to Enhance Precision and Execution of Real-Time Control

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813