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AEC-Q100 Qualified and Defense-grade PolarFire FPGAs Now Available in Volume Production
Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments

Automotive, defense, aerospace and industrial designers who need automotive- and defense-grade programmable logic solutions can now order PolarFire® Field Programmable Gate Arrays  (FPGAs) in volume production quantities. Microchip Technology (Nasdaq: MCHP) today announced it is shipping PolarFire FPGAs qualified for both the Automotive Electronics Council Q100 (AEC-Q100) specification Grade T2 (-40°C to 125°C TJ) and military temperature grade (-40°C to 125°C TJ).

These offerings extend Microchip’s low-power leadership as a supplier of FPGAs for diverse high-reliability markets. With their thermal and space design constraints, automotive, industrial and military applications deployed in harsh environments require solutions that offer power and space efficiency as well as cryptographic security. PolarFire FPGAs offer on-chip security features that enable secure communication, an encrypted bitstream, and a cryptographically secured supply chain, ensuring tamper-proof solutions for these market segments.

Unlike SRAM-based FPGAs, Microchip devices can operate without fans and in some cases without heatsinks, simplifying the thermal design of the system and creating new opportunities for smaller, lighter designs. This is especially important in automotive applications such as blind spot detection, lane change warning systems and back up cameras. Additionally, the extended temperature range of our military grade devices coupled with our state-of-the-art security enables developers to trust and add more compute power within a thermally constrained environments such as those found in advanced strategic weapons systems.

“Removing heat from a system is not free,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “The less heat you move, the lower your total system costs become. In some cases, complete removal of fans from systems, which often have a low mean time between failure, is possible. Automotive and aerospace design engineers can now develop mid-range FPGA solutions with the lowest total power, highest reliability, and best-in-class security technologies, all at a lower total system cost.”

About AEC-Q100

AEC-Q100 is a failure-mechanism-based stress test qualification for packaged integrated circuits used in automotive applications. This specification has been established by the AEC to define qualification requirements and procedures for packaged integrated circuits used in the automotive industry. An AEC-Q100 qualified device means that the device has passed the specified stress tests and guarantees a certain level of quality/reliability.

About the PolarFire FPGA

PolarFire FPGAs deliver up to 50% lower power than competing solutions. The family of devices pan from 100K Logic Elements (LEs) to 500K LEs and feature 12.7G transceivers.

Libero® SoC Design Suite, the development tool for designing with Microchip’s FPGAs and SoCs, now supports both AEC-Q100 and military-temperature-grade FPGAs today.

Availability

PolarFire automotive- and military-grade FPGAs are available in volume production. They are supported by development boards, Microchip’s Libero® software tool suite, VectorBlox™ Accelerator Software Development Kit and IP, plus Microchip’s High-Level Synthesis (HLS) tool for edge compute solutions. More information can be found at: www.microchip.com/polarfire.

Please let us know if you would like to speak to a subject matter expert on Microchip’s PolarFire FPGAs and the challenges of high-thermal requirements of certain applications.

2021031701 / 17.03.2021 / Electronic-components / Microchip Technology Inc. /

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
Added voltage level shifting capabilities help increase flexibility and reduce system costs

To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC
Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements

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