Address Book
 

Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

Digi-Key Electronics
 

Durakool
 

KEMET
 

INTEL
 

CODICO
 

Future Electronics
 

Foremost Electronics
 

Littelfuse
 

Mouser Electronics
 

RUTRONIK
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Interesting video
Various
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

Getting in the fast lane to Gen4

Getting in the fast lane to Gen4

congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors

congatec – a leading vendor of embedded and edge computing technology – presents a brand new COM-HPC™ starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel® Core™ processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few. 

“Our new COM-HPC starter set – which can be ordered with a choice of individually compiled components from our COM-HPC ecosystem – puts engineers in the fast lane to Gen4 interface technology and further ultra fast connectivity,” says Martin Danzer, Director Product Management at congatec. “PCIe Gen4 doubles the throughput per lane compared to Gen3, which has massive effects on system designs as it enables engineers to double the number of connected extension devices. Handling all this under more complex design rules to achieve the required signal compliance makes it even more important to have a mature evaluation and benchmark platform for own system designs.” 

The starter set’s various Ethernet configuration options range from 8x 1GbE switching options and 2x 2.5 GbE including TSN support up to dual 10 GbE connectivity. congatec’s comprehensive AI support for MIPI-CSI connected cameras from Basler adds further application readiness to IIoT and Industry 4.0 connected embedded systems. AI and inferencing acceleration can be achieved with Intel® DL Boost running on the CPU vector neural network instructions (VNNI), or with 8-bit integer instructions on the GPU (Int8). Attractive in this context is the support of the Intel Open Vino ecosystem for AI, which comes with a library of functions and optimized calls for OpenCV and OpenCL kernels to accelerate deep neural network workloads across multiple platforms to achieve faster, more accurate results for AI inference. The starter set presented at embedded world 2021 DIGITAL is based on the following components of congatec’s COM-HPC ecosystem: 

ATX compliant carrier board conga-HPC/EVAL-Client

The ATX compliant carrier board conga-HPC/EVAL-Client incorporates all interfaces specified by the new COM-HPC Client standard and supports the extended temperature range from -40°C to +85°C. It comes with two massively performant PCIe Gen4 x16 connectors plus a variety of LAN data bandwidths, data transfer methods and connectors, including 2x 10 GbE, 2.5 GbE and 1GbE support. Over mezzanine cards, the carrier can run even higher-performance interfaces up to 2x25 GbE, making this evaluation platform a perfect fit for massively connected edge devices. The board supports the COM-HPC sizes A, B and C, and includes all interfaces engineers require for programming, firmware flashing and reset. 

New conga-HPC/cTLU COM-HPC Client module

The heart of the presented starter set for COM-HPC Client designs, the conga-HPC/cTLU computer-on-module, is available in different processor configurations. For each of these configurations, three different cooling solutions are available that fit the entire configurable 12-28W TPD range of the 11th Gen Intel® Core™ processors. 

Processor Cores/Threads Frequency at 28/15/12W TDP (Max Turbo) [GHz] Cache [MB] Graphics Execution Units Ext. Temp. range InBand ECC
Intel® Core™ i7-1185G7E 4/8 2.8/1.8/1.2 (4.4) 12 96 - -
Intel® Core™ i7-1185GRE     4/8 2.8/1.8/1.2 (4.4) 12 96 yes yes
Intel® Core™ i5-1145G7E     4/8 2.6/1.5/1.1 (4.1) 8 80 - -
Intel® Core™ i5-1145GRE 4/8 2.6/1.5/1.1 (4.1) 8 80 yes yes
Intel® Core™ i3-1115G4E     2/4 3.0/2.2/1.7 (3.9) 6 48 - -
Intel® Core™ i3-1115GRE     2/4 3.0/2.2/1.7 (3.9) 6 48 yes yes
Intel® Celeron® 6305E 2/2 1.8 (n/a) 4 48 - -

 

The product page of the conga-HPC/cTLU can be found at:
https://www.congatec.com/en/products/com-hpc/conga-hpcctlu/

The product page of the conga-HPC/EVAL can be found at:
https://www.congatec.com/en/products/accessories/conga-hpceval-client/

2021042702 / 27.04.2021 / Embedded / congatec AG /

congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
Low power flagship for embedded vision and AI
.....
Getting in the fast lane to Gen4
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors
.....
Getting in the fast lane to Gen4
congatec to solve ruggedization challenges of edge server and client designs
congatec to solve ruggedization challenges of edge server and client designs
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC
.....
ANYbotics’ ANYmal C robot is a multi-module machine
Rugged four-legged robot with three brains
.....
ANYbotics’ ANYmal C robot is a multi-module machine
First COM-HPC and next-gen COM Express
First COM-HPC and next-gen COM Express
congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options
.....
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
More performance and less dollars per watt
.....
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand
.....
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
.....
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
.....
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-on-Modules (COM) Advantages when compared to a full custom design.
.....
Computer-On-Modules are world-leading platforms for embedded system designs
congatec launches 100 Watt ecosystem for embedded edge and micro servers
congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
.....
congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
.....
congatec doubles RAM support for Server-on-Modules
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec welcomes official release of the COM Express 3.0 specification
congatec welcomes official release of the COM Express 3.0 specification
congatec’s Type 7 Server-on-Modules are now PICMG standard
.....
congatec’s new COM Express Mini module with Intel Apollo Lake processors
Offers more than any credit card sized COM Express module before
.....
congatec’s new COM Express Mini module with Intel Apollo Lake processors
Company of the week

Lynred
Interesting video


Phoenix Contact Dialog Days - 12.-16.4.2021


Arduino LED filament clock


How Intel Makes Chips: Concept to Customer


How Do You Minimize Bubbles in a Two Part Epoxy System?


Adafruit Partners with Panasonic
Address Book


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Microchip Technology Inc.


ON Semiconductor


Molex, LLC


NeoPhotonics


Murata Manufacturing Co.,


NEXPERIA
Calendary
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813