Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

20.11.2024 0:07:20
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Today’s energy-efficient electric charging systems powering commercial vehicle propulsion, as well as auxiliary power systems, solar inverters, solid-state transformers and other transportation and industrial applications all rely on high-voltage switching power devices. To meet these requirements, Microchip Technology Inc. (Nasdaq: MCHP) today announced the expansion of its silicon carbide portfolio with a family of high-efficiency, high-reliability 1700V silicon carbide MOSFET die, discrete and power modules.

Microchip’s 1700V silicon carbide technology is an alternative to silicon IGBTs. The earlier technology required designers to compromise performance and use complicated topologies due to restrictions on switching frequency by lossy silicon IGBTs. In addition, the size and weight of power electronic systems are bloated by transformers, which can only be reduced in size by increasing switching frequency.

The new silicon carbide product family allows engineers to move beyond IGBTs, instead using two-level topologies with reduced part count, greater efficiency and simpler control schemes. Without switching limitations, power conversion units can be significantly reduced in size and weight, freeing up space for more charging stations, additional room for paying passengers and cargo, or extending the range and operating time of heavy vehicles, electric buses and other battery-powered commercial vehicles – all at reduced overall system cost.

“System developers in the transportation segment are continuously asked to fit more people and goods into vehicles that cannot be made larger,” said Leon Gross, vice president of Microchip’s discrete product business unit. “One of the best ways to help achieve this is through the enormous reductions in size and weight of power conversion equipment that utilizes high-voltage silicon carbide power devices. These same advantages for transportation bring similar benefits to many other industry applications.”

Features include gate oxide stability where Microchip observed no shift in threshold voltage even after an extended 100,000 pulses in repetitive unclamped inductive switching (R-UIS) tests. R-UIS tests also showed excellent avalanche ruggedness and parametric stability and with gate oxide stability, demonstrated reliable operation over the life of the system. The degradation-free body diode can eliminate the need to use an external diode with the silicon carbide MOSFET. A short-circuit withstand capability comparable to IGBTs survives harmful electrical transients. A flatter RDS(on) curve over junction temperature from 0 to 175 degrees Celsius (C) enables the power system to operate at greater stability than other silicon carbide MOSFETs that exhibit more sensitivity to temperature.

Microchip streamlines the adoption of its technology with a family of AgileSwitch® digital programmable gate drivers and wide range of discrete and power module packaging, available in standard and customizable formats. These gate drivers help speed silicon carbide development from benchtop to production.

Other Microchip silicon carbide products include families of MOSFETs and Schottky Barrier diodes at 700V and 1200V, available in bare die and a variety of discrete and power module packages. Microchip unifies in-house silicon carbide die production with low-inductance power packaging and digital programmable gate drivers to enable designers to make the most efficient, compact and reliable end products.

The company’s total system solutions also include a portfolio of microcontrollers (MCUs), analog and MCU peripherals, and communication, wireless and security technology.

Development Tools

Silicon carbide SPICE simulation models compatible with Microchip’s MPLAB® Mindi™ analog simulator provide system developers with resources to simulate switching characteristics before committing to hardware design. The Intelligent Configuration Tool (ICT) enables designers to model efficient silicon carbide gate driver settings for Microchip’s AgileSwitch® family of digital programmable gate drivers.

Availability

Microchip’s 1700V silicon carbide MOSFET die, discrete and power modules are available now for order in a variety of package options.

For information including pricing, contact a Microchip sales representative, authorized worldwide distributor or visit the company’s website. To purchase products mentioned here, contact a Microchip authorized distributor.

2021072801 / 05.08.2021 / Electronic-components / Microchip Technology Inc. /

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions

Microchip Releases 20 Advanced Wi-Fi® Products for Industrial and Commercial Applications
Company’s wireless connectivity portfolio represents one of the industry’s most extensive selection of Wi-Fi solutions and comprehensive support systems

New VelocityDRIVE™ Software Platform and Automotive-Qualified Multi-Gigabit Ethernet Switches for Software-Defined Vehicles

New Family of Voltage-Controlled Saw Oscillators With Ultra-Low Phase Noise Performance for Radar Applications
Microchip’s VCSO 101765 devices are available in 320 MHz and 400 MHz with a small form factor

New Solution from Microchip Makes it Easier to Build Sophisticated Graphical User Interfaces for MPLAB® Harmony v3 and Linux® Environments

Functional Safety Certification for Microchip’s PolarFire® FPGAs Speeds Time to Market
Certified tool flow and safety data package available for both IEC 61508 SIL 3 and ISO 26262 ASIL D standards

Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability
Microchip’s LAN887x PHYs offer extended reach up to 40m and are designed to be compliant with industry standards

Microchip Technology Adds ECC20x and SHA10x Families of Secure Authentication ICs to TrustFLEX Platform
Pre-Configured CryptoAuthentication™ ICs help reduce development time and minimize design costs

Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.

Pick Your Power with Microchip’s New Electric Vehicle Charger Reference Designs
Flexible and scalable EV charger reference designs are designed to meet unique regional requirements

Microchip Introduces High-Performance PCIe® Gen 5 SSD Controller Family
Flashtec® NVMe® 5016 controllers are optimized to manage growing enterprise and data center workloads

Microchip Technology Introduces a New Core in the dsPIC® Digital Signal Controller Family to Enhance Precision and Execution of Real-Time Control

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813