Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

21.12.2024 11:32:23
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Power Integrations’ HiperLCS-2 Chipset Boosts LLC Converter Efficiency, Slashes Component Count by 40 Percent
Surface-mount LLC chipset delivers 250 W with over 98 percent efficiency and no heatsink; no-load consumption is less than 50 mW

Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the energy-saving HiperLCS™-2 chipset, a new IC family that dramatically simplifies the design and manufacture of LLC resonant power converters. The new dual-chip solution features an isolation device with a high-bandwidth LLC controller, synchronous rectification driver and FluxLink™ isolated control link, alongside a separate half-bridge power device utilizing Power Integrations’ unique 600 V FREDFETs with lossless current sensing and high- and low-side drivers. Both devices are housed in low-profile InSOP™-24 packages. This highly integrated, energy-efficient architecture eliminates heatsinks and reduces component count by up to 40 percent compared to discrete designs.

Edward Ong, senior product marketing manager at Power Integrations said: "Resonant converters using separate controllers and discrete MOSFETs can be incredibly bulky and are notoriously difficult to manufacture due to their complexity and high component count. We have applied our advanced FREDFETs and magneto-inductive FluxLink technology to the LLC topology, yielding 98 percent efficiency and reducing component count by 40 percent, while eliminating bulky heatsinks and unreliable optocouplers. This enables designers to create compact adapters and open-frame power supplies for TVs, monitors with USB PD ports, all-in-one PCs, game consoles and battery chargers for power tools and e-bikes.”

Resonant converters are typically used wherever an application demands a level of efficiency unachievable with single-switch topologies such as flyback converters. The HiperLCS-2 chipset leverages Power Integrations’ high-speed FluxLink feedback mechanism to avoid the compromises normally associated with the LLC topology, permitting designers to quickly and consistently implement designs with high performance, wide operating range and low component count.

Power supply designs based on the new HiperLCS-2 can achieve no-load input power of less than 50 mW at 400 VDC input and provide a continuously regulated output, easily complying with the world's most stringent no-load and standby efficiency regulations. HiperLCS-2 devices operate at high efficiency across the load range with dissipation so low that direct heat transfer through the FR4 PCB is all that is required, eliminating heatsinks in adapter designs up to 220 W continuous output with up to 170 percent peak power capability. All HiperLCS-2 family members feature self-powered start-up and provide the start-up bias for a PFC stage using the company’s HiperPFS™ ICs. Secondary-side sensing provides less than one percent regulation accuracy across line and load range and across production variations. The use of Power Integrations’ FluxLink technology for safety-isolated high-speed digital feedback control provides much faster transient response and far superior long-term reliability compared to optocouplers.

Availability & Resources

A reference design, DER-672, is available to download for designers who want to evaluate HiperLCS-2 ICs. Pricing for the HiperLCS-2 starts at $3.20 per chipset in 10,000 unit quantities. For further information, please contact a Power Integrations sales representative.

2022042701 / 27.04.2022 / Electronic-components / Power Integrations /

Power Integrations Launches 1700 V GaN Switcher IC, Setting New Benchmark for Gallium Nitride Technology
1700 V GaN InnoMux-2 IC delivers efficiency of better than 90 percent from a 1000 VDC bus, supplying up to 70 W from three accurately regulated outputs

Power Integrations Combines Programmability, High Efficiency and Small Form Factor in New Zero-Voltage-Switching Power-Supply ICs
InnoSwitch4-Pro family of flyback switchers enable over 95 percent efficient, compact, USB PD and Universal Fast Charging Specification adapters up to 220 W

Power Integrations Debuts Support for Planar Magnetics in PI Expert Power Supply Design Tool
Software automatically generates a planar transformer design with full electrical specification and build documentation in just five minutes

Power Integrations Launches PowerPros Live Video Application-Engineering Support
Solve design challenges in real-time, 24 hours a day, six days a week

Power Integrations Delivers AEC-Qualified Buck Switcher IC with 850 mA Output for Low-Part-Count Automotive PSUs
LinkSwitch-TN2Q supports 30-550 VDC input with integrated system-level protection

Power Integrations Bundles New Three-Phase BLDC Control Software into Motor-Expert Suite for BridgeSwitch IC Family
Hardware-Software Solution for Three-Phase BLDC Motor Inverters Enables Greater Than 98 Percent Efficiency, Saves PCB Space and Speeds Time-to-Market

Power Integrations Expands InnoSwitch4-CZ Integrated Switcher Family to 220 W
New high-voltage GaN switches boost efficiency to 95 percent, yielding ultra-compact USB PD 3.1 adapters

Power Integrations Launches SCALE EV: Automotive-Qualified IGBT/SiC Module Driver Family; Targets Bus, Truck and Con-Ag EVs
Compact driver board features reinforced isolation, ASIL B/C certification

Power Integrations’ HiperLCS-2 Chipset Boosts LLC Converter Efficiency, Slashes Component Count by 40 Percent
Surface-mount LLC chipset delivers 250 W with over 98 percent efficiency and no heatsink; no-load consumption is less than 50 mW

Power Integrations Introduces Industry’s First Automotive-Qualified High-Voltage Switcher ICs with 1700 V SiC MOSFET
Expanded InnoSwitch3 family slashes component count and boosts efficiency in EV and industrial applications

Power Integrations’ New InnoSwitch3-TN ICs Slash Energy Waste in Appliance Power Supplies by 75%
Beyond the buck regulator: Newest InnoSwitch3 IC family delivers simplicity, flexibility, and industry-leading efficiency in high-output-current designs

Power Integrations Releases InnoSwitch3-PD Reference Design for Ultra-Compact USB Type C, PD + PPS Adapter
DER-937 leverages highly integrated boost PFC and GaN flyback switcher ICs to implement 100 W USB PD charger using only 117 components

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
asiamold select, Guangzhou, CHN, 25.-27.2.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813