Parker’s Latest High Performance Thermal Gap Filler Pad Offers Ultra-Low Hardness
New THERM-A-GAP™ PAD 10 from Parker Chomerics ensures highest conformability at low clamping forces
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is introducing THERM-A-GAP™ PAD 10, a series of thermally conductive gap filler pads for applications where high performance and ultra-low shore hardness are primary material requirements. Design engineers can benefit from the new pad’s 1.0 W/m-K of thermal conductivity and hardness of just 35 Shore 00 for the highest conformability at low clamping forces.
Gap filler pads serve as thermally conductive materials that sit between a heat-generating component, such as a semiconductor or battery, and a heat-dissipating surface. The new THERM-A-GAP™ PAD 10 is an ultra-conformable and cost effective gap filler sheet solution for use in applications featuring uneven component surfaces or tight spaces.
Electronic products set to benefit include: complex PC and server assemblies, microprocessors and GPUs; high-power LED lighting; consumer electronics; automotive electronics such as ECUs and battery cells; telecommunications equipment; and power conversion electronics featuring intricate heatsinks.
Thermal gap pads are a preferred solution among product designers and engineers because of their design flexibility and ease of use. The new Parker Chomerics pads are RoHS-compliant and feature a high-tack surface to reduce contact resistance, an operating temperature range of -55°C to +200°C, a UL 94 V-0 flammability rating and are also electrically isolating. Electrical properties include: 8 kVac/mm dielectric strength (ASTM D149 test method); 1014 Ω-cm volume resistivity (ASTM D257); 5.3 dielectric constant at 1,000 kHz (ASTM D150); and 0.013 dissipation factor at 1,000 kHz (Chomerics TM-TP13 test method).
THERM-A-GAP PAD 10 is available in various thicknesses from 0.254 mm to 5.0 mm (in increments of 0.254 mm) and comes in standard sheets measuring 228.6 mm x 228.6 mm. Carrier substrate options include aluminium foil with a pressure sensitive adhesive (PSA) or woven glass without PSA.
Custom size configurations and die-cut parts are available individually or on sheets. Design engineers can request quotes for custom sizes online simply by choosing the required thickness and carrier options, then selecting ‘custom’ size.
Learn more about THERM-A-GAP™ PAD 10 at: https://ph.parker.com/gb/en/product-list/therm-a-gap-pad-10-thermally-conductive-gap-filler-pads