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Infineon’s new XHP™ 2 CoolSiC™ high-power modules boost efficiency and power density in high-voltage energy systems
Infineon Technologies AG expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems. The new 2300 V class devices support DC-link voltages of up to 1500 V, addressing the industry trend toward higher system voltages.

The modules are available in several variants, offering on-resistance (RDS(on)) values ranging from 1 mΩ to 2 mΩ and isolation voltages of 4 kV or 6 kV. By leveraging silicon carbide (SiC) technology, the devices reduce both switching and conduction losses compared to conventional silicon-based solutions. This enables inverters to achieve higher efficiency and power density, or to operate at higher switching frequencies to reduce harmonics and system size. The new XHP 2 CoolSiC MOSFET modules are well suited for renewable energy applications, including wind, photovoltaic and battery storage systems. 

Implemented in the XHP 2 package, the modules feature symmetrical switching behavior for easy paralleling in large power converters and offer a standardized platform that enables developers to balance efficiency and performance according to application requirements. All variants integrate Infineon’s proven .XT interconnection technology, enhancing reliability and extending operational lifetime. The modules are also available with a pre-applied thermal interface material, simplifying assembly while supporting consistent thermal performance. 

These characteristics translate into measurable system-level benefits. In a wind power demonstration system, a power density of 300 kW/L was achieved, while tests in battery storage systems showed semiconductor losses of less than 0.7 percent of the output power. With this portfolio expansion, Infineon supports scalable solutions for next-generation high-voltage power systems across a wide range of renewable energy applications.

Availability

The XHP 2 CoolSiC MOSFET modules with a 2300 V rating, FF1000UXTR23T2M1, FF1300UXTR23T2M1, FF2000UXTR23T2M1, and FF1000UXTR23T2M1_B5, are available now from Infineon and its distribution partners.

More information is available at https://www.infineon.com/products/power/mosfet/silicon-carbide/modules.

2026051201 / 24.05.2026 / Electronic-components / Infineon Technologies AG /

Infineon’s new XHP™ 2 CoolSiC™ high-power modules boost efficiency and power density in high-voltage energy systems
Infineon Technologies AG expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems. The new 2300 V class devices support DC-link voltages of up to 1500 V, addressing the industry trend toward higher system voltages.

Infineon extends the CoolSiC™ MOSFET 750 V G2 family featuring ultra-low RDS(on) and new packages

Infineon’s integrated advanced MEMS-based ultrasound transducer enables new industrial and medical use cases

Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste

Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility

New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.

Infineon unveils CoolSiC™ MOSFETs 400 V redefining power density and efficiency in AI server power supplies

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems

Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects


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Texas Instruments

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SENSOR+TEST 2026, Nuremberg, 9.-11.6.2026
electronica 2026, München, DE, 10.-13.11.2026

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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