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Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Technology (Nasdaq: MCHP) announced a demonstration showcasing an end‑to‑end PCIe® Gen 6 storage architecture, combining Microchip’s Switchtec™ PCIe Gen 6 switches with high-performance Micron 9650 NVMe® solid state drives (SSDs). The demonstration highlights the role of next‑generation PCIe technology in enabling higher data throughput, reduced latency and scalable connectivity for AI, high‑performance computing (HPC) and cloud data center workloads.

At the 2026 Future of Memory and Storage (FMS) Conference, the demonstration features a Microchip Switchtec Gen 6 PCIe fanout switch acting as a high‑bandwidth, low‑latency interconnect between host processors and multiple Micron 9650 SSDs enabling the drives to operate at the full potential of Gen 6 speed. The architecture supports composable and disaggregated system designs, allowing data center architects to scale storage resources efficiently while maintaining predictable performance.

“Advancing data center performance is not solved by any single component and our work with Micron highlights the importance of taking a cohesive approach,” said Brian McCarson, corporate vice president and GM of Microchip’s data center solutions business unit. “We’re bringing together complementary strengths in switching and storage to demonstrate how a well‑aligned ecosystem can enable scalable, high‑bandwidth architectures for next‑generation AI and cloud platforms.”

As AI models grow in size and complexity, data centers must move increasingly large volumes of data across compute, memory and storage resources. PCIe 6.0 helps address this challenge by doubling PCIe 5.0 bandwidth to 64 GT/s (giga transfers per second) per lane, delivering the sustained throughput required for demanding AI workloads.

“AI infrastructure is entering a new era in which storage performance and ecosystem interoperability must advance in lockstep,” said Larry Hart, senior director of solutions marketing for Micron’s Core Data Center Business Unit. “Together, the Micron 9650 SSD, the industry’s first mass-produced PCIe Gen 6 SSD, and Microchip’s Switchtec PCIe Gen 6 switching technology demonstrate how a scalable storage architecture can help data centers achieve higher throughput, lower latency and more efficient data movement for next-generation AI, HPC and cloud workloads.”

Microchip's Switchtec Gen 6 PCIe switches are built on 3 nm process technology and support high lane counts, advanced error containment, comprehensive diagnostics and multicast functionality that enables efficient one-to-many data distribution across devices within a PCIe domain. The switches enable high-speed connectivity between CPUs, GPUs, SoCs, AI accelerators and storage devices while helping optimize power consumption in demanding computing environments. These capabilities help ensure reliable data movement and system resilience in AI and cloud infrastructure. To help protect system integrity, the switches incorporate a hardware root of trust and secure boot architecture supported by post-quantum-safe cryptographic algorithms that meet CNSA 2.0 security standards.

Micron 9650 PCIe Gen 6 NVMe SSDs are designed to deliver exceptional throughput, IOPS and latency characteristics required for data‑intensive workloads such as AI training, real‑time analytics and large‑scale databases. By combining Micron’s storage technology with Microchip’s switching capability, the solution demonstrates a balanced, high‑performance storage fabric optimized for next‑generation platforms. Visit the website to learn more about Microchip’s full portfolio of data center solutions.

2026090201 / 02.09.2026 / Electronic-components / Microchip Technology Inc. /

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Advances Neural Network Implementation with VectorBlox™ 3.0 Accelerator Software Development Kit
Latest release leverages sparse neural networks to improve performance and enable more efficient edge AI on PolarFire® FPGAs and SoCs

XpressConnect™ PCIe® 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high‑bandwidth architectures while helping reduce integration complexity

Essential Performance and Real-time Control Without the Baggage
Microchip’s dsPIC33CK Value Line DSCs offer streamlined design for cost-sensitive applications and consistent pricing regardless of order size

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
Ruggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety
Microchip’s LAN878x and LAN888x PHY families enable secure, scalable and deterministic Ethernet connectivity for automotive and industrial systems

New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families

Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
With SuperFlash® memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing

New Power Module Enhances AI Data Center Power Density and Efficiency
Microchip’s MCPF1525 power module with PMBus™ delivers 25A DC-DC power, stackable up to 200A

PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio
Low-power, 5V‑capable devices deliver high performance while preserving low system complexity and costs

Microchip Expands maXTouch® M1 Touchscreen Controller Series for Broader Display Size Coverage
New Touch controllers bring reliable touch sensing to both very small and very large display formats in modern automotive applications


Company of the week

Vox Power

Interesting video


productronica 2025


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE

Address Book


Vox Power


Texas Instruments


STMicroelectronics


Future Electronics


TELEDYNE Vision Solution


Vexlum


Mitsubishi Electric


Parker Hannifin


QUECTEL


Infineon Technologies AG


Seica


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics



Calendary
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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