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New 8 x 8 mm addition to Nexperia’s LFPAK MOSFET family delivers up to 48x power density
Nexperia announced a new package in its MOSFET and LFPAK family which, when combined with its latest silicon technology, results in 40 V MOSFETs delivering a low RDS(on) of 0.7 mΩ. LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8 mm offer a footprint reduction of 60 %, and a 64 % lower profile.

Unlike other packages where performance is often limited by internal bond wires, LFPAK88 devices employ the copper-clip and solder die attach construction, resulting in low electrical & thermal resistance, good current spreading and heat dispersal. In addition, the thermal mass of the copper-clip also reduces hot-spot formation which results in improved avalanche energy (Eas) and linear-mode (SOA) performance. The combination of high continuous and demonstrated current rating ID(max) of 425 A and low RDS(on) of 0.7 mΩ in a smaller package size, presents market-leading power density of up to 48 times when compared to D2PAK devices.

Finally, the LFPAK88, with its low-stress gull wing leads is a more rugged and thermally robust package, delivering reliability levels more than two times better than is required by AEC-Q101. Comments Neil Massey, Product Manager at Nexperia: “Combining the LFPAK88 with our silicon technology results in MOSFETs that deliver 48x the power density of D2PAK. This proves that Nexperia, the inventor of the LFPAK, is still the leader in this technology.”

LFPAK88 MOSFETs are available in both automotive-qualified (BUK) and industrial (PSMN) grades. Automotive applications include braking, power steering, reverse battery protection and DC-DC converters, where the space-savings that can be achieved by using the devices is particularly useful in dual-redundant circuits. Industrial applications include battery-powered power tools, professional power supplies, and telecoms infrastructure equipment.  

More information on the new 40V LFPAK88 MOSFETs, including product specs and datasheets is available at www.nexperia.com/lfpak88.

2019050703 / 07.05.2019 / Electronic-components / NEXPERIA /

Extended NextPower 80/100V MOSFET portfolio from Nexperia offers increased design flexibility

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

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NeoCortec

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Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



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