Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

20.11.2024 0:07:20
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

KIOXIA introduces new levels of performance with Enterprise NVMe SSD family featuring PCIe 5.0 technology
CM7 series SSDs available in new EDSFF E3.S and industry standard 2.5-inch form factors

KIOXIA Europe GmbH today announced that its CM7 Series enterprise NVMe SSDs are now shipping to select customers. Optimized for the needs of high-performance, highly efficient servers and storage, the CM7 family is designed with PCIe 5.0 technology in Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S and 2.5-inch form factors[1].

Having introduced the industry’s first EDSFF drives designed with PCIe 5.0 technology[2] last year, the addition of the CM7 Series expands KIOXIA's leadership position and allows OEM customers to deliver best-in-class[3] performance to end users: These SSDs saturate the PCIe 5.0 interface at 14GB/s read throughput.

The EDSFF E3 family enables the next generation of SSDs with PCIe 5.0 technology and beyond to address future datacenter architectures, while supporting a variety of new devices and applications. It provides improved airflow and thermals, signal integrity benefits, eliminates the need for LEDs on the drive carriers, and gives options for larger SSD capacity points.

  • EDSFF E3.S and 2.5-inch 15mm Z-height form factors (U.2 and U.3)
  • Designed to the NVMe 2.0 and PCIe 5.0 specifications, and supports SFF-TA-1001/U.3 functionality
  • SFF-TA-1001 (also known as U.3 [1]) capable with Universal Backplane Management enabled systems
  • Read-intensive (1 DWPD) capacities up to 30.72TB[4]
  • Mixed-use (3 DWPD) capacities up to 12.80TB
  • Dual-port design for high availability applications
  • Flash Die Failure Protection maintains full reliability in case of a die failure
  • Cutting edge feature support - SRIOV, CMB, multistream writes

Paul Rowan, vice president of SSD marketing and engineering at KIOIXA Europe GmbH commented: "With AI and ML applications on the rise, storage demands are exponentially increasing to unprecedented levels. Solutions are needed that can deliver a dramatic ramp up in capacity, while still maintaining the same degrees of quality, reliability and endurance. Our EDSFF drives with PCIe 5.0 technology respond to these requirements, seamlessly doubling performance. They also offer the quality that KIOXIA customers have come to expect from us as the acknowledged inventors of NAND flash."

2022081801 / 18.08.2022 / Electronic-components / KIOXIA Europe GmbH /

KIOXIA sampling latest generation UFS ver. 4.0 embedded flash memory devices
Smaller package size and performance improvements contribute to better user experience on mobile applications

KIOXIA introduces new levels of performance with Enterprise NVMe SSD family featuring PCIe 5.0 technology
CM7 series SSDs available in new EDSFF E3.S and industry standard 2.5-inch form factors

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813